基于面板的射频集成无源器件

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) Pub Date : 2017-05-01 DOI:10.1109/ECTC.2017.256

Ming-Hung Chen, Tzu-Hsing Chiang, Jia-Hao Zhang, Hsu-Chiang Shih, Sheng-Chi Hsieh, T. Lee, C. Hung

{"title":"基于面板的射频集成无源器件","authors":"Ming-Hung Chen, Tzu-Hsing Chiang, Jia-Hao Zhang, Hsu-Chiang Shih, Sheng-Chi Hsieh, T. Lee, C. Hung","doi":"10.1109/ECTC.2017.256","DOIUrl":null,"url":null,"abstract":"In this paper, a mass production solution of integrated passive device utilized on radio frequency communication systems was proposed through a glass panel platform where the size could be up to 408 mm * 512 mm and provided 1-layer capacitor and 1-layer inductor for IPD design. The structure characterization of panel-based IPD was performed as well as the electrical stability and RF functional test were evaluated to show the capability reference for further applications. The panel-based process could also provide a cost effective solution on emerging production.","PeriodicalId":6557,"journal":{"name":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","volume":"13 1","pages":"185-189"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Panel-Based Integrated Passive Device for RF Applicatio\",\"authors\":\"Ming-Hung Chen, Tzu-Hsing Chiang, Jia-Hao Zhang, Hsu-Chiang Shih, Sheng-Chi Hsieh, T. Lee, C. Hung\",\"doi\":\"10.1109/ECTC.2017.256\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a mass production solution of integrated passive device utilized on radio frequency communication systems was proposed through a glass panel platform where the size could be up to 408 mm * 512 mm and provided 1-layer capacitor and 1-layer inductor for IPD design. The structure characterization of panel-based IPD was performed as well as the electrical stability and RF functional test were evaluated to show the capability reference for further applications. The panel-based process could also provide a cost effective solution on emerging production.\",\"PeriodicalId\":6557,\"journal\":{\"name\":\"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"13 1\",\"pages\":\"185-189\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2017.256\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2017.256","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文提出了一种用于射频通信系统的集成无源器件的量产解决方案，该方案通过尺寸可达408 mm * 512 mm的玻璃面板平台，为IPD设计提供1层电容和1层电感。对基于面板的IPD进行了结构表征，并进行了电稳定性和射频功能测试，为进一步应用提供了性能参考。基于面板的工艺也可以为新兴生产提供具有成本效益的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Panel-Based Integrated Passive Device for RF Applicatio

In this paper, a mass production solution of integrated passive device utilized on radio frequency communication systems was proposed through a glass panel platform where the size could be up to 408 mm * 512 mm and provided 1-layer capacitor and 1-layer inductor for IPD design. The structure characterization of panel-based IPD was performed as well as the electrical stability and RF functional test were evaluated to show the capability reference for further applications. The panel-based process could also provide a cost effective solution on emerging production.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

自引率

0.00%

发文量