{"title":"基于JEDEC标准的板级跌落冲击印刷电路板设计","authors":"Jian Gu, Y. Lei, Jian Lin, H. Fu, Zhong-wei Wu","doi":"10.1109/ICEPT.2016.7583203","DOIUrl":null,"url":null,"abstract":"the reliability of solder joint under drop impact is a crucial research area due to the smaller and higher density. The test standard for board level has been published by JEDEC in detail. Based on JEDEC board level drop test standard, the square board with four symmetry component is designed in this paper. The structure size of test board is 0.5mm×121mm×121mm. The distance of the center component to the center of test board is 15mm. The first six modal frequency is 23.56Hz, 136.37Hz, 138.53Hz, 165.98Hz, 346.35Hz and 394.56Hz respectively. This Design benefits for the board level drop life of solder joint statistics analysis. And the 0.5mm thickness design can be used as replacement test board to analyze the failure mechanism of solder joint under relative high drop impact level.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"64 1","pages":"588-591"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Design of the printed circuit board for board level drop impact base on the JEDEC standard\",\"authors\":\"Jian Gu, Y. Lei, Jian Lin, H. Fu, Zhong-wei Wu\",\"doi\":\"10.1109/ICEPT.2016.7583203\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"the reliability of solder joint under drop impact is a crucial research area due to the smaller and higher density. The test standard for board level has been published by JEDEC in detail. Based on JEDEC board level drop test standard, the square board with four symmetry component is designed in this paper. The structure size of test board is 0.5mm×121mm×121mm. The distance of the center component to the center of test board is 15mm. The first six modal frequency is 23.56Hz, 136.37Hz, 138.53Hz, 165.98Hz, 346.35Hz and 394.56Hz respectively. This Design benefits for the board level drop life of solder joint statistics analysis. And the 0.5mm thickness design can be used as replacement test board to analyze the failure mechanism of solder joint under relative high drop impact level.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"64 1\",\"pages\":\"588-591\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583203\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583203","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design of the printed circuit board for board level drop impact base on the JEDEC standard
the reliability of solder joint under drop impact is a crucial research area due to the smaller and higher density. The test standard for board level has been published by JEDEC in detail. Based on JEDEC board level drop test standard, the square board with four symmetry component is designed in this paper. The structure size of test board is 0.5mm×121mm×121mm. The distance of the center component to the center of test board is 15mm. The first six modal frequency is 23.56Hz, 136.37Hz, 138.53Hz, 165.98Hz, 346.35Hz and 394.56Hz respectively. This Design benefits for the board level drop life of solder joint statistics analysis. And the 0.5mm thickness design can be used as replacement test board to analyze the failure mechanism of solder joint under relative high drop impact level.
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