{"title":"超声电机在机床加工微加工中的应用","authors":"K. Egashira, T. Masuzawa, M. Fujino, Xi-Qing Sun","doi":"10.1109/KORUS.2000.866068","DOIUrl":null,"url":null,"abstract":"Most machining methods have difficulties in machining hard, brittle materials such as glass, ceramics, <.md silicon. Ultrasonic machining (USM) is a unique method from this point of view, because it easily machines these materials. However, US.M has a lilnitation in its application to micromachining because there moe problems in fixing microtools to the machine <.md maintaining high precision. In this paper we propose a technique of micro-USIvI by applying on-the-machine tool fabrication by wire electrodischm'ge glinding (WEDG). As a result, we were able to make microholes as small as 20}lm in diameter on a silicon plate. Additional expeliments revealed the possibility of wide application.","PeriodicalId":20531,"journal":{"name":"Proceedings KORUS 2000. The 4th Korea-Russia International Symposium On Science and Technology","volume":"87 1","pages":"106-115"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"35","resultStr":"{\"title\":\"Application of USM to micromachining by on-the-machine tool fabrication\",\"authors\":\"K. Egashira, T. Masuzawa, M. Fujino, Xi-Qing Sun\",\"doi\":\"10.1109/KORUS.2000.866068\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Most machining methods have difficulties in machining hard, brittle materials such as glass, ceramics, <.md silicon. Ultrasonic machining (USM) is a unique method from this point of view, because it easily machines these materials. However, US.M has a lilnitation in its application to micromachining because there moe problems in fixing microtools to the machine <.md maintaining high precision. In this paper we propose a technique of micro-USIvI by applying on-the-machine tool fabrication by wire electrodischm'ge glinding (WEDG). As a result, we were able to make microholes as small as 20}lm in diameter on a silicon plate. Additional expeliments revealed the possibility of wide application.\",\"PeriodicalId\":20531,\"journal\":{\"name\":\"Proceedings KORUS 2000. The 4th Korea-Russia International Symposium On Science and Technology\",\"volume\":\"87 1\",\"pages\":\"106-115\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"35\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings KORUS 2000. The 4th Korea-Russia International Symposium On Science and Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/KORUS.2000.866068\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings KORUS 2000. The 4th Korea-Russia International Symposium On Science and Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/KORUS.2000.866068","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Application of USM to micromachining by on-the-machine tool fabrication
Most machining methods have difficulties in machining hard, brittle materials such as glass, ceramics, <.md silicon. Ultrasonic machining (USM) is a unique method from this point of view, because it easily machines these materials. However, US.M has a lilnitation in its application to micromachining because there moe problems in fixing microtools to the machine <.md maintaining high precision. In this paper we propose a technique of micro-USIvI by applying on-the-machine tool fabrication by wire electrodischm'ge glinding (WEDG). As a result, we were able to make microholes as small as 20}lm in diameter on a silicon plate. Additional expeliments revealed the possibility of wide application.