用于系统级篡改检测的片上阻抗传感

Tahoura Mosavirik, P. Schaumont, Shahin Tajik
{"title":"用于系统级篡改检测的片上阻抗传感","authors":"Tahoura Mosavirik, P. Schaumont, Shahin Tajik","doi":"10.46586/tches.v2023.i1.301-325","DOIUrl":null,"url":null,"abstract":"Physical attacks can compromise the security of cryptographic devices. Depending on the attack’s requirements, adversaries might need to (i) place probes in the proximity of the integrated circuits (ICs) package, (ii) create physical connections between their probes/wires and the system’s PCB, or (iii) physically tamper with the PCB’s components, chip’s package, or substitute the entire PCB to prepare the device for the attack. While tamper-proof enclosures prevent and detect physical access to the system, their high manufacturing cost and incompatibility with legacy systems make them unattractive for many low-cost scenarios. In this paper, inspired by methods known from the field of power integrity analysis, we demonstrate how the impedance characterization of the system’s power distribution network (PDN) using on-chip circuit-based network analyzers can detect various classes of tamper events. We explain how these embedded network analyzers, without any modifications to the system, can be deployed on FPGAs to extract the frequency response of the PDN. The analysis of these frequency responses reveals different classes of tamper events from board to chip level. To validate our claims, we run an embedded network analyzer on FPGAs of a family of commercial development kits and perform extensive measurements for various classes of PCB and IC package tampering required for conducting different side-channel or fault attacks. Using the Wasserstein Distance as a statistical metric, we further show that we can confidently detect tamper events. Our results, interestingly, show that even environment-level tampering activities, such as the proximity of contactless EM probes to the IC package or slightly polished IC package, can be detected using on-chip impedance sensing.","PeriodicalId":13186,"journal":{"name":"IACR Trans. Cryptogr. Hardw. Embed. Syst.","volume":"9 1","pages":"301-325"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"ImpedanceVerif: On-Chip Impedance Sensing for System-Level Tampering Detection\",\"authors\":\"Tahoura Mosavirik, P. Schaumont, Shahin Tajik\",\"doi\":\"10.46586/tches.v2023.i1.301-325\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Physical attacks can compromise the security of cryptographic devices. Depending on the attack’s requirements, adversaries might need to (i) place probes in the proximity of the integrated circuits (ICs) package, (ii) create physical connections between their probes/wires and the system’s PCB, or (iii) physically tamper with the PCB’s components, chip’s package, or substitute the entire PCB to prepare the device for the attack. While tamper-proof enclosures prevent and detect physical access to the system, their high manufacturing cost and incompatibility with legacy systems make them unattractive for many low-cost scenarios. In this paper, inspired by methods known from the field of power integrity analysis, we demonstrate how the impedance characterization of the system’s power distribution network (PDN) using on-chip circuit-based network analyzers can detect various classes of tamper events. We explain how these embedded network analyzers, without any modifications to the system, can be deployed on FPGAs to extract the frequency response of the PDN. The analysis of these frequency responses reveals different classes of tamper events from board to chip level. To validate our claims, we run an embedded network analyzer on FPGAs of a family of commercial development kits and perform extensive measurements for various classes of PCB and IC package tampering required for conducting different side-channel or fault attacks. Using the Wasserstein Distance as a statistical metric, we further show that we can confidently detect tamper events. Our results, interestingly, show that even environment-level tampering activities, such as the proximity of contactless EM probes to the IC package or slightly polished IC package, can be detected using on-chip impedance sensing.\",\"PeriodicalId\":13186,\"journal\":{\"name\":\"IACR Trans. Cryptogr. Hardw. Embed. Syst.\",\"volume\":\"9 1\",\"pages\":\"301-325\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-11-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IACR Trans. Cryptogr. Hardw. Embed. Syst.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.46586/tches.v2023.i1.301-325\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IACR Trans. Cryptogr. Hardw. Embed. Syst.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.46586/tches.v2023.i1.301-325","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

摘要

物理攻击会危及加密设备的安全性。根据攻击的要求,攻击者可能需要(i)将探针放置在集成电路(ic)封装附近,(ii)在探针/电线与系统PCB之间建立物理连接,或(iii)物理篡改PCB的组件,芯片的封装,或替换整个PCB以准备设备进行攻击。虽然防篡改外壳可以防止和检测对系统的物理访问,但它们的高制造成本和与传统系统的不兼容性使它们在许多低成本场景中没有吸引力。在本文中,受功率完整性分析领域已知方法的启发,我们演示了如何使用基于片上电路的网络分析仪对系统配电网络(PDN)进行阻抗表征,以检测各种类型的篡改事件。我们解释了这些嵌入式网络分析仪如何在不修改系统的情况下部署在fpga上以提取PDN的频率响应。对这些频率响应的分析揭示了从板到芯片级别的不同类别的篡改事件。为了验证我们的主张,我们在一系列商业开发套件的fpga上运行嵌入式网络分析仪,并对进行不同侧信道或故障攻击所需的各种类型的PCB和IC封装篡改进行广泛的测量。使用Wasserstein距离作为统计度量,我们进一步证明我们可以自信地检测篡改事件。有趣的是,我们的研究结果表明,即使是环境级别的篡改活动,例如非接触式电磁探头靠近IC封装或稍微抛光的IC封装,也可以使用片上阻抗传感检测到。
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ImpedanceVerif: On-Chip Impedance Sensing for System-Level Tampering Detection
Physical attacks can compromise the security of cryptographic devices. Depending on the attack’s requirements, adversaries might need to (i) place probes in the proximity of the integrated circuits (ICs) package, (ii) create physical connections between their probes/wires and the system’s PCB, or (iii) physically tamper with the PCB’s components, chip’s package, or substitute the entire PCB to prepare the device for the attack. While tamper-proof enclosures prevent and detect physical access to the system, their high manufacturing cost and incompatibility with legacy systems make them unattractive for many low-cost scenarios. In this paper, inspired by methods known from the field of power integrity analysis, we demonstrate how the impedance characterization of the system’s power distribution network (PDN) using on-chip circuit-based network analyzers can detect various classes of tamper events. We explain how these embedded network analyzers, without any modifications to the system, can be deployed on FPGAs to extract the frequency response of the PDN. The analysis of these frequency responses reveals different classes of tamper events from board to chip level. To validate our claims, we run an embedded network analyzer on FPGAs of a family of commercial development kits and perform extensive measurements for various classes of PCB and IC package tampering required for conducting different side-channel or fault attacks. Using the Wasserstein Distance as a statistical metric, we further show that we can confidently detect tamper events. Our results, interestingly, show that even environment-level tampering activities, such as the proximity of contactless EM probes to the IC package or slightly polished IC package, can be detected using on-chip impedance sensing.
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