从根本上解决纳米电子学领域热物理问题的新方法

V. Khvesyuk, A. Barinov, B. Liu, W. Qiao
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引用次数: 0

摘要

目前,固体热物理的快速发展与建立具有高度预测可靠性的模型的需求有关。本文提出了解决半导体和电介质传热研究相关问题的新方法,主要涉及纳米结构。首先考虑的任务是建立热载体-声子-与固体粗糙表面相互作用过程的统计模型。首次提出了一种基于随机曲面轮廓斜率统计的方法。计算结果是样品相对边界之间声子的平均自由程,这是计算弹道和扩散-弹道传热模式下有效热导率所必需的,取决于粗糙度参数。第二项任务是发展计算通过固体接触面传热过程的方法。我们能够证明,考虑到声子色散和相应的频率值限制,用于计算Kapitsa电阻的修正声学失配模型可以扩展到300 K以上的温度。以前,这种方法的适用极限被认为是在30 K的温度下。此外,该方法也可推广到粗糙界面的情况。第三项任务是确定固体导热系数的新方法。作者开发了一种直接蒙特卡罗模拟声子动力学的方法,由于直接使用能量守恒定律和准动量定律,严格考虑了声子动力学的相互作用。纯硅在100 ~ 300 K温度范围内的导热系数计算结果与其他作者的实验和从头计算结果一致,也使我们能够详细地考虑声子的动力学。
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Fundamentally new approaches to solving thermophysical problems in the field of nanoelectronics
Currently, there is a rapid development of thermophysics of solids associated with the need of creating models with a high degree of predictive reliability. This paper presents new approaches to solving relevant issues related to the study of heat transfer in semiconductors and dielectrics, mainly concerning nano-structures. The first of the considered tasks is the creation of a statistical model of the processes of interaction of heat carriers – phonons – with rough surfaces of solids. For the first time authors proposed a method based on the statistics of the slopes of the profile of a random surface. The calculation results are the mean free paths of phonon between the opposite boundaries of the sample, which are necessary for calculating the effective thermal conductivity in ballistic and diffusion-ballistic regime of heat transfer, depending on the roughness parameters. The second task is to develop methods for calculating the processes of heat transfer through the contact surfaces of solids. We were able to show that, taking into account the phonon dispersion and the corresponding restrictions on the frequency values, the modified acoustic mismatch model for calculating Kapitsa resistances can be extended to temperatures above 300 K. Previously, the limit of applicability of this method was considered to be a temperature of 30 K. Moreover, the proposed method is also generalized to the case of rough interfaces. The third task is a new approach to determining the thermal conductivity of solids. The authors have developed a method of direct Monte Carlo simulation of phonon kinetics with strict consideration of their interaction due to the direct use of the laws of conservation of energy and quasi-momentum. The calculations of the thermal conductivity coefficient for pure silicon in the temperature range from 100 to 300 K showed good agreement with the experiment and ab initio calculations of other authors, and also allowed us to consider in detail the kinetics of phonons.
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