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摘要

100 GHz以上的高毫米波和太赫兹频谱将构成一系列改变游戏规则的未来技术的基础,包括高分辨率传感、成像、机器人、自主系统和无线通信。在过去的十年中,我们已经看到了巨大的努力,使芯片级技术能够解决太赫兹频谱中的信号产生和检测。然而,要将这些努力转化为能够在复杂环境中运行的通用技术,还存在一些基本挑战,这些环境需要动态可重构性和快速适应性等特性。在本文中,我们强调了一种新的设计空间,它通过消除经典的逐块设计方法而出现。这种方法背后的基本原理是,太赫兹(毫米/亚毫米数量级)的独特波长尺度与典型的芯片尺寸相当。这种波长/芯片尺寸等效使芯片能够在具有新散射和辐射特性的新电磁(EM)状态下工作,而集成的有源器件具有主动合成、操纵和感知亚波长尺度太赫兹电磁场的能力。这种方法开辟了一个新的设计空间,可以打破经典设计制度中的许多权衡。在本文中,我们提供了旨在实现硅基芯片中最终可编程太赫兹传感器/源的设计示例,其范围从完全集成的芯片级太赫兹光谱仪到可编程太赫兹传感器、源和用于物理层安全的时空调制阵列。这些设计示例说明了通过这种整体设计方法实现的独特机会。
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Terahertz to bits and bits to terahertz: universally programmable chip-scale terahertz systems
The high millimeter-Wave and Terahertz spectrum above 100 GHz will form the underpinning of a broad set of game-changing future technology including high resolution sensing, imaging, robotics, autonomous systems, and wireless communication. In the last decade, we have seen a tremendous surge in efforts towards enabling chip-scale technology to address signal generation and detection in the THz spectrum. However, there lie several fundamental challenges to translate these efforts into versatile technology that can operate in complex environments that requires properties such as dynamic reconfigurability and rapid adaptability. In this paper, we highlight a new design space that emerges by eliminating the classical block-by-bock design approach. The fundamental principle behind this approach is that the unique wavelength scale at THz (of the order of millimeter/sub-millimeter) is comparable to a typical chip dimension. This wavelength/chip dimension equivalence allows the chip to operate in a new electromagnetic (EM) regime with novel scattering and radiating properties, while the integrated active devices have the ability to actively synthesize, manipulate and sense THz EM fields at sub-wavelength scales. This approach opens up the a new design space that can break many of the trade-offs in the classical design regime. In this paper, we provide design examples that aims towards the ultimate programmable THz sensor/source in silicon-based chips that range from fully integrated chip-scale THz spectroscopes to programmable THz sensors, sources and spatio-temporal modulated arrays for physical layer security. These design examples serve to illustrate the unique opportunities enabled through such a holistic design approach.
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