J. Cui, Mengxia Liu, Haibing Yang, Dong Li, Qiancheng Zhao
{"title":"温度稳健硅谐振加速度计与应力隔离框架安装在轴对称锚","authors":"J. Cui, Mengxia Liu, Haibing Yang, Dong Li, Qiancheng Zhao","doi":"10.1109/MEMS46641.2020.9056157","DOIUrl":null,"url":null,"abstract":"This paper presents a novel silicon resonant accelerometer (SRA) with a stress isolation frame mounted on axis-symmetrical anchors to improve the temperature performance. The stress-insensitive design prevents the thermal stress produced by the mismatch of the thermal expansion coefficients (CTE) of the heterogeneous materials in the device from transmitting to double-ended tuning forks (DETF), resulting in reducing the thermal sensitivity of SRA. The results show the scale factor is 516 Hz/g and the average nominal frequency of the two DETFs is ∼138.4 kHz with the closely matched temperature coefficients of frequency (TCF) 5.72 Hz/°C and 5.92 Hz/ °C, respectively. The bias thermal sensitivity and compensated stability are 0.42 mg/°C and 0.6 mg over the temperature range from −40 °C to 40 °C, which is competitive compared with previously reported results in literatures.","PeriodicalId":6776,"journal":{"name":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"10 1","pages":"791-794"},"PeriodicalIF":0.0000,"publicationDate":"2020-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Temperature Robust Silicon Resonant Accelerometer with Stress Isolation Frame Mounted on Axis-Symmetrical Anchors\",\"authors\":\"J. Cui, Mengxia Liu, Haibing Yang, Dong Li, Qiancheng Zhao\",\"doi\":\"10.1109/MEMS46641.2020.9056157\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a novel silicon resonant accelerometer (SRA) with a stress isolation frame mounted on axis-symmetrical anchors to improve the temperature performance. The stress-insensitive design prevents the thermal stress produced by the mismatch of the thermal expansion coefficients (CTE) of the heterogeneous materials in the device from transmitting to double-ended tuning forks (DETF), resulting in reducing the thermal sensitivity of SRA. The results show the scale factor is 516 Hz/g and the average nominal frequency of the two DETFs is ∼138.4 kHz with the closely matched temperature coefficients of frequency (TCF) 5.72 Hz/°C and 5.92 Hz/ °C, respectively. The bias thermal sensitivity and compensated stability are 0.42 mg/°C and 0.6 mg over the temperature range from −40 °C to 40 °C, which is competitive compared with previously reported results in literatures.\",\"PeriodicalId\":6776,\"journal\":{\"name\":\"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)\",\"volume\":\"10 1\",\"pages\":\"791-794\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMS46641.2020.9056157\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 33rd International Conference on Micro Electro Mechanical Systems (MEMS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMS46641.2020.9056157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Temperature Robust Silicon Resonant Accelerometer with Stress Isolation Frame Mounted on Axis-Symmetrical Anchors
This paper presents a novel silicon resonant accelerometer (SRA) with a stress isolation frame mounted on axis-symmetrical anchors to improve the temperature performance. The stress-insensitive design prevents the thermal stress produced by the mismatch of the thermal expansion coefficients (CTE) of the heterogeneous materials in the device from transmitting to double-ended tuning forks (DETF), resulting in reducing the thermal sensitivity of SRA. The results show the scale factor is 516 Hz/g and the average nominal frequency of the two DETFs is ∼138.4 kHz with the closely matched temperature coefficients of frequency (TCF) 5.72 Hz/°C and 5.92 Hz/ °C, respectively. The bias thermal sensitivity and compensated stability are 0.42 mg/°C and 0.6 mg over the temperature range from −40 °C to 40 °C, which is competitive compared with previously reported results in literatures.