由聚氨酯和银纳米/微结构制成的可拉伸和导电复合材料

B. Song, K. Moon, C. Wong
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引用次数: 5

摘要

近年来,可拉伸导电复合材料在高端微电子领域的应用受到了广泛的关注。在这里,我们报告了导电和可拉伸的复合材料,将各种形状改性银填料纳入聚氨酯弹性体基体。通过选择聚氨酯的软段和硬段,不仅可以提供足够的拉伸性/柔韧性,还可以减少由于羟基的存在而在银表面产生的表面活性剂。采用三种导电填料,包括银片、合成银纳米线和三维银枝晶。当银片质量分数为80%时,该导电复合材料的电阻率可低至5×10-5 .cm。宽高比大于100的银纳米线可以实现较低的电渗透阈值。采用简单的溶液法制备了银枝晶,具有低成本、可规模化生产的特点。通过调节前驱体和还原剂的投料速度和摩尔比,可以精细地控制支化纳米/微结构。在不进行任何表面处理的情况下,当填料含量为70%时,印刷的复合薄膜的体积电阻率为~ 8×10-4 .cm。相容性弹性体内导电填料的设计在便携式和可穿戴电子设备中显示出巨大的潜力。
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Stretchable and Electrically Conductive Composites Fabricated from Polyurethane and Silver Nano/Microstructures
Stretchable conductive composites have received considerable research interest recently for high-end microelectronic applications. Here we report conductive and stretchable composites by incorporating various shape-modified silver fillers into polyurethane elastomer matrix. By selecting soft and hard segments of polyurethane, the polymer resin can not only provide sufficient stretchability/flexibility, but also serve to reduce the surfactants on silver surface due to the presence of hydroxyl groups. Three conductive fillers, including commercial silver flakes, synthesized silver nanowires and three-dimensional silver dendrites were employed. The conductive composites could achieve resistivity as low as 5×10-5 .cm at using 80 wt% of silver flakes. The silver nanowires, with aspect ratio higher than 100, can achieve low electrical percolation threshold. The silver dendrite were prepared by a simple solution process with the capability for scalable production at low cost. The branched nano/microstructures can be delicately controlled by tuning the feeding speed and molar ratio of the silver precursor and reducing agent. Without any surface treatment, the bulk resistivity of the printed composite films was ~ 8×10-4 .cm at 70 wt% filler loading. The design of the conductive fillers within compatible elastomers show great potentials for portable and wearable electronic devices.
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