{"title":"N2加入对氢和甲烷基电感耦合脉冲等离子体中物质动力学的影响","authors":"S. Jacq, C. Cardinaud, L. Le Brizoual, A. Granier","doi":"10.1109/PLASMA.2013.6635040","DOIUrl":null,"url":null,"abstract":"In microelectronics and microtechnology, as the semiconductor feature size decreases and pattern density increases, the industry is facing the challenge of finding new plasma processes to meet the requirement of the next devices generation. Within this scheme pulsed RF plasmas are increasingly being employed for plasma etching or deposition. Besides the interest for potential applications, pulsed plasmas combined to time resolved measurements are known to be powerful tools to study species kinetics.","PeriodicalId":6313,"journal":{"name":"2013 Abstracts IEEE International Conference on Plasma Science (ICOPS)","volume":"11 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of N2 addition on species kinetics in hydrogen and methane based inductively coupled pulsed plasmas\",\"authors\":\"S. Jacq, C. Cardinaud, L. Le Brizoual, A. Granier\",\"doi\":\"10.1109/PLASMA.2013.6635040\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In microelectronics and microtechnology, as the semiconductor feature size decreases and pattern density increases, the industry is facing the challenge of finding new plasma processes to meet the requirement of the next devices generation. Within this scheme pulsed RF plasmas are increasingly being employed for plasma etching or deposition. Besides the interest for potential applications, pulsed plasmas combined to time resolved measurements are known to be powerful tools to study species kinetics.\",\"PeriodicalId\":6313,\"journal\":{\"name\":\"2013 Abstracts IEEE International Conference on Plasma Science (ICOPS)\",\"volume\":\"11 1\",\"pages\":\"1-1\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-06-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 Abstracts IEEE International Conference on Plasma Science (ICOPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PLASMA.2013.6635040\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Abstracts IEEE International Conference on Plasma Science (ICOPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PLASMA.2013.6635040","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of N2 addition on species kinetics in hydrogen and methane based inductively coupled pulsed plasmas
In microelectronics and microtechnology, as the semiconductor feature size decreases and pattern density increases, the industry is facing the challenge of finding new plasma processes to meet the requirement of the next devices generation. Within this scheme pulsed RF plasmas are increasingly being employed for plasma etching or deposition. Besides the interest for potential applications, pulsed plasmas combined to time resolved measurements are known to be powerful tools to study species kinetics.