低能球磨在韧性粉末中的纳米晶粒形成

J Guerrero-Paz , D Jaramillo-Vigueras
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引用次数: 12

摘要

基于透射电镜的显微组织观察和沉积光度法的粒度分布,提出了一种新的机械合金化韧性粉末粒度细化机理。90-95%的粒子群是亚微米级的碎片粒子。这些都是从铣削过程开始到90k检测到的。原始颗粒的破碎似乎是在动态条件下发生的,从而产生了亚微米颗粒。在这些条件下,原始晶粒尺寸(100 nm至350 nm)被保留,并且在这些亚微米颗粒上观察到低水平的位错。一旦这些亚微米颗粒变形,就会观察到小于20纳米的颗粒。从TEM结果来看,亚微米颗粒在动态条件下也发生了变形。这可能是一种新的晶粒细化机制,存在于韧性金属粉末体系中,其中破碎是从铣削开始到铣削中间时间的主要阶段。在Cu-20at%Ni、Cu和Ni体系中,在整个铣削过程中,颗粒聚结过程是主导阶段,对Hellstern[3]提出的机制进行了推导。在我们的情况下,粉末主要是由于滑移而不是剪切而变形的。它承认在磨粉中细化粒度的方法至少受到所使用的金属体系以及所采用的设备和工艺条件的影响。
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Nanometric grain formation in ductile powders by low-energy ball milling

Based on microstructural observations by TEM and in particle size distribution done by sedimentation-photometry, a new grain size refinement mechanism for ductile powders in mechanical alloying is proposed. A 90–95% of the particle population was of submicrometric fragmented particles. These were detected from the beginning of the milling process up to 90 ks. It seems that the fragmentation of the original particles occurred under dynamic conditions to generate those submicrometric ones. Under these conditions the original grain size (100 nm to 350 nm) was preserved and a low level of dislocations was observed at these submicrometric particles. Once these submicrometric particles were deformed, grains smaller than 20 nm were observed. It seems from TEM results that the submicrometric fragmented particles were also deformed under dynamic conditions. This could be a new grain size refinement mechanism present in ductile metallic powder systems where the fragmentation is the dominant stage from the beginning of the milling up to some intermediate milling time.

In the Cu-20at%Ni, Cu and Ni systems where the particle coalescence process was the dominant stage during all the milling process, a derivation of the mechanism proposed by Hellstern [3] was identified. In our case, powders were mainly deformed by slip and not by shear.

It recognizes that the way to refine the grain size in milled powders is influenced at least by the metallic system used as well as by the equipment and the process conditions employed.

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