生产规模无焊剂碰撞回流使用电子附着

C. Dong, R. E. Patrick, Gregory K. Arslanian, Tim Bao, K. Wathne, Phillip Skeen
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引用次数: 4

摘要

本文介绍了空气产品公司和西卡玛国际公司最近共同努力的一项工作,即基于电子附着(EA)的无熔剂硅片凹凸回流炉的生产规模试验。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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Production-scale flux-free bump reflow using electron attachment
This paper introduces a recent work by a joint effort between Air Products and Sikama International on alpha trials of a production-scale furnace for flux-free wafer bump reflow based on electron attachment (EA).
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