专为微波器件增材制造而设计的高k低损耗介质复合原料丝

Vishvajitsinh Kosamiya, Jing Wang
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摘要

在这项工作中,研究了一种改进的方法,使陶瓷-热塑性复合原料长丝具有定制的介电性能。采用基于预测模型的方法制备了具有不同陶瓷填料体积比和陶瓷填料表面条件的多种热塑性复合材料长丝。在高达18 GHz的频率下,内部制备的3D打印复合材料的相对介电常数为12,损耗正切为0.003,其体积为50%的陶瓷微粒填料。对3D打印复合材料薄板试样进行了表面处理和未经表面处理的介电性能比较。所选表面处理的复合材料的介电常数测量值增加,而测量的介电损耗切线变化不显著。新制备的材料被用于打印Ku波段介质波导(DWG),该波导在17.5 GHz下具有0.017 dB/mm的低损耗。
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High-k and Low-Loss Dielectric Composite Feedstock Filaments, Tailored for Additive Manufacturing of Microwave Devices
In this work, an improved methodology of making ceramic-thermoplastic composite feedstock filament with tailored dielectric properties is pursued. Prediction model-based approach is implemented for manufacturing a wide variety of thermoplastic composite filaments with varied ceramic filler volume ratios and ceramic filler surface conditions. A relative permittivity of 12 and a loss tangent of 0.003 have been demonstrated at frequencies up to 18 GHz for in-house prepared 3D printable composites loaded with 50% ceramic micro-particle fillers in volume. A comparison of dielectric properties of the 3D printed composite thin-sheet test specimens with and without surface treatment is performed. The composites with the chosen surface treatment exhibit an increment in measured permittivity values, while having insignificant change in measured dielectric loss tangents. The newly prepared filaments were used to print a Ku band dielectric waveguide (DWG), which has exhibited an impressive low loss of 0.017 dB/mm at 17.5 GHz.
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