功率MOSFET模块热电过程建模

V. Smirnov, A. M. Hodakov, A. A. Gavrikov
{"title":"功率MOSFET模块热电过程建模","authors":"V. Smirnov, A. M. Hodakov, A. A. Gavrikov","doi":"10.17725/rensit.2023.15.117","DOIUrl":null,"url":null,"abstract":"The paper represents thermal model of power MOSFET module based on a transistors mounted on copper-ceramic DBC (Direct Bond Copper) plate. The analysis of thermal processes in the module caused by pulse heating of particular transistors was performed by the finite elements method using COMSOL Multiphysics. The model performs estimation of the temperature field on the DBC plate and transistors overheat temperature. The modeling results was compared to the experiment – thermal impedance matrix measured by the modulation method using the heating power modulated by the harmonic law. Analysis of the data obtained allows to conclude that the calculated and experimental values of the dies overheating temperature are in good agreement with each other and confirms the correctness of the developed thermal power module model","PeriodicalId":37476,"journal":{"name":"Radioelektronika, Nanosistemy, Informacionnye Tehnologii","volume":"42 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2023-06-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modeling of thermoelectrical processes in a power MOSFET modules\",\"authors\":\"V. Smirnov, A. M. Hodakov, A. A. Gavrikov\",\"doi\":\"10.17725/rensit.2023.15.117\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper represents thermal model of power MOSFET module based on a transistors mounted on copper-ceramic DBC (Direct Bond Copper) plate. The analysis of thermal processes in the module caused by pulse heating of particular transistors was performed by the finite elements method using COMSOL Multiphysics. The model performs estimation of the temperature field on the DBC plate and transistors overheat temperature. The modeling results was compared to the experiment – thermal impedance matrix measured by the modulation method using the heating power modulated by the harmonic law. Analysis of the data obtained allows to conclude that the calculated and experimental values of the dies overheating temperature are in good agreement with each other and confirms the correctness of the developed thermal power module model\",\"PeriodicalId\":37476,\"journal\":{\"name\":\"Radioelektronika, Nanosistemy, Informacionnye Tehnologii\",\"volume\":\"42 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-06-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Radioelektronika, Nanosistemy, Informacionnye Tehnologii\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.17725/rensit.2023.15.117\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Materials Science\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Radioelektronika, Nanosistemy, Informacionnye Tehnologii","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.17725/rensit.2023.15.117","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Materials Science","Score":null,"Total":0}
引用次数: 0

摘要

本文给出了基于铜陶瓷DBC (Direct Bond Copper)板上晶体管的功率MOSFET模块的热模型。采用COMSOL Multiphysics软件,对特定晶体管的脉冲加热引起的模块热过程进行了有限元分析。该模型对DBC板的温度场和晶体管过热温度进行了估计。并将模拟结果与实验结果进行了对比——利用谐波调制的加热功率调制方法测得的热阻抗矩阵。对所得数据的分析表明,模具过热温度的计算值与实验值吻合较好,证实了所建立的热功率模块模型的正确性
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Modeling of thermoelectrical processes in a power MOSFET modules
The paper represents thermal model of power MOSFET module based on a transistors mounted on copper-ceramic DBC (Direct Bond Copper) plate. The analysis of thermal processes in the module caused by pulse heating of particular transistors was performed by the finite elements method using COMSOL Multiphysics. The model performs estimation of the temperature field on the DBC plate and transistors overheat temperature. The modeling results was compared to the experiment – thermal impedance matrix measured by the modulation method using the heating power modulated by the harmonic law. Analysis of the data obtained allows to conclude that the calculated and experimental values of the dies overheating temperature are in good agreement with each other and confirms the correctness of the developed thermal power module model
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来源期刊
Radioelektronika, Nanosistemy, Informacionnye Tehnologii
Radioelektronika, Nanosistemy, Informacionnye Tehnologii Materials Science-Materials Science (miscellaneous)
CiteScore
0.60
自引率
0.00%
发文量
38
期刊介绍: Journal “Radioelectronics. Nanosystems. Information Technologies” (abbr RENSIT) publishes original articles, reviews and brief reports, not previously published, on topical problems in radioelectronics (including biomedical) and fundamentals of information, nano- and biotechnologies and adjacent areas of physics and mathematics. The authors of the journal are academicians, corresponding members and foreign members of the Russian Academy of Natural Sciences (RANS) and their colleagues, as well as other russian and foreign authors on the proposal of the members of RANS, which can be obtained by the author before sending articles to the editor or after its arrival on the recommendation of a member of the editorial board or another member of the RANS, who gave the opinion on the article at the request of the editior. The editors will accept articles in both Russian and English languages. Articles are internally peer reviewed (double-blind peer review) by members of the Editorial Board. Some articles undergo external review, if necessary. Designed for researchers, graduate students, physics students of senior courses and teachers. It turns out 2 times a year (that includes 2 rooms)
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