A. Lucibello, G. de Angelis, E. Proietti, R. Marcelli, G. Bartolucci
{"title":"微加工硅片共面接地波导技术与测试","authors":"A. Lucibello, G. de Angelis, E. Proietti, R. Marcelli, G. Bartolucci","doi":"10.1109/SMICND.2008.4703374","DOIUrl":null,"url":null,"abstract":"Coplanar wave-guide grounded lines (CPWG) have been designed, realized by micro-machining of high resistivity silicon wafers and tested up to 40 GHz. Different configurations have been compared between them by changing the dimensions of the micro-machined via-holes used for the ground connection, as well as their number and separation, to get the optimal electrical matching conditions. Wide-band matching and losses as low as 0.1-0.2 dB/mm have been obtained within the 40 GHz range, in agreement with the predicted behaviour.","PeriodicalId":6406,"journal":{"name":"2008 IEEE International Conference on Semiconductor Electronics","volume":"32 1","pages":"219-222"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Technology and test of coplanar grounded wave-guides on micro-machined Si wafers\",\"authors\":\"A. Lucibello, G. de Angelis, E. Proietti, R. Marcelli, G. Bartolucci\",\"doi\":\"10.1109/SMICND.2008.4703374\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Coplanar wave-guide grounded lines (CPWG) have been designed, realized by micro-machining of high resistivity silicon wafers and tested up to 40 GHz. Different configurations have been compared between them by changing the dimensions of the micro-machined via-holes used for the ground connection, as well as their number and separation, to get the optimal electrical matching conditions. Wide-band matching and losses as low as 0.1-0.2 dB/mm have been obtained within the 40 GHz range, in agreement with the predicted behaviour.\",\"PeriodicalId\":6406,\"journal\":{\"name\":\"2008 IEEE International Conference on Semiconductor Electronics\",\"volume\":\"32 1\",\"pages\":\"219-222\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-12-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE International Conference on Semiconductor Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2008.4703374\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Conference on Semiconductor Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2008.4703374","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Technology and test of coplanar grounded wave-guides on micro-machined Si wafers
Coplanar wave-guide grounded lines (CPWG) have been designed, realized by micro-machining of high resistivity silicon wafers and tested up to 40 GHz. Different configurations have been compared between them by changing the dimensions of the micro-machined via-holes used for the ground connection, as well as their number and separation, to get the optimal electrical matching conditions. Wide-band matching and losses as low as 0.1-0.2 dB/mm have been obtained within the 40 GHz range, in agreement with the predicted behaviour.
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