PSPI暴露过程中DHP温度效应的研究

Doyoung Kim, Kyung-Sek Song, Chankyun Kim, S. Lee
{"title":"PSPI暴露过程中DHP温度效应的研究","authors":"Doyoung Kim, Kyung-Sek Song, Chankyun Kim, S. Lee","doi":"10.1109/SMICND.2008.4703354","DOIUrl":null,"url":null,"abstract":"PSPI has been applied to the end-fab process for better efficiency. However, it causes process time to increase, which can be a serious problem in the photo process. Excessive exposure time results in lower efficiency and lower productivity as well. It is also blamed for a damage of expensive equipment lens. Existing countermeasures have yet to clear those problems. As an alternative, DHP temperature control is expected to reduce exposure time by adjusting the hardness of PSPI. Consequently, exposure time per shot can be sharply reduced, enhancing productivity of photo process where many shots are repeatedly exposed to a wafer.","PeriodicalId":6406,"journal":{"name":"2008 IEEE International Conference on Semiconductor Electronics","volume":"16 1","pages":"151-154"},"PeriodicalIF":0.0000,"publicationDate":"2008-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Study on DHP temperature effect in PSPI exposure process\",\"authors\":\"Doyoung Kim, Kyung-Sek Song, Chankyun Kim, S. Lee\",\"doi\":\"10.1109/SMICND.2008.4703354\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"PSPI has been applied to the end-fab process for better efficiency. However, it causes process time to increase, which can be a serious problem in the photo process. Excessive exposure time results in lower efficiency and lower productivity as well. It is also blamed for a damage of expensive equipment lens. Existing countermeasures have yet to clear those problems. As an alternative, DHP temperature control is expected to reduce exposure time by adjusting the hardness of PSPI. Consequently, exposure time per shot can be sharply reduced, enhancing productivity of photo process where many shots are repeatedly exposed to a wafer.\",\"PeriodicalId\":6406,\"journal\":{\"name\":\"2008 IEEE International Conference on Semiconductor Electronics\",\"volume\":\"16 1\",\"pages\":\"151-154\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-12-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE International Conference on Semiconductor Electronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMICND.2008.4703354\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE International Conference on Semiconductor Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMICND.2008.4703354","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

PSPI已应用于晶圆末端工艺,以提高效率。然而,它会导致处理时间增加,这在照相过程中可能是一个严重的问题。曝光时间过长会导致效率和生产率降低。它还被指责损坏了昂贵的设备镜头。现有的对策还没有解决这些问题。作为替代方案,DHP温度控制有望通过调整PSPI的硬度来减少曝光时间。因此,每个镜头的曝光时间可以大幅减少,提高了许多镜头反复曝光在晶圆片上的照片工艺的生产率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Study on DHP temperature effect in PSPI exposure process
PSPI has been applied to the end-fab process for better efficiency. However, it causes process time to increase, which can be a serious problem in the photo process. Excessive exposure time results in lower efficiency and lower productivity as well. It is also blamed for a damage of expensive equipment lens. Existing countermeasures have yet to clear those problems. As an alternative, DHP temperature control is expected to reduce exposure time by adjusting the hardness of PSPI. Consequently, exposure time per shot can be sharply reduced, enhancing productivity of photo process where many shots are repeatedly exposed to a wafer.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Packaged single pole double thru (SPDT) and true time delay lines (TTDL) based on RF MEMS switches Aromatic polyimides for optoelectronic applications Design and optimization of an electrostatic actuated micromirror with isolated bottom electrode on silicon substrate Designing devices for avionics applications and the DO-254 guideline RF NEMS based on carbon nanotubes and graphene
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1