使用代工平台的36gb /s BiCMOS驱动程序和InP EAM操作

M. Trajkovic, Xi Zhang, F. Blache, K. Mekhazni, M. Matters-Kammerer, H. Debrégeas, X. Leijtens, K. Williams
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引用次数: 2

摘要

我们展示了一个清晰的眼图,在36 Gb/s的速度下,BiCMOS驱动器直接与通过代工平台制造的InP电吸收调制器(EAM)线连接。该驱动器采用0.25 μm SiGe:C BiCMOS技术制造,单端时最大振幅为2 Vp-p。驱动器直流耦合到调制器,简化了电子-光子组件。EAM工作在1590nm的l波段,直流偏置设置为-1.6 V,用于开关键控不归零调制。我们测量了从10到40 Gb/s的运行,分别记录了5到3 dB的动态消光比。使用代工平台不需要改变任何制造工艺,并提供了广泛的高性能光电子集成电路。
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36 Gb/s operation of a BiCMOS driver and InP EAM using foundry platforms
We demonstrate a clear eye-diagram at 36 Gb/s of a BiCMOS driver directly wire-bonded to an InP electro-absorption modulator (EAM) both fabricated through foundry platforms. The driver is fabricated in a 0.25 μm SiGe:C BiCMOS technology and delivers a maximum of 2 Vp-p amplitude when single-ended. The driver is DC-coupled to the modulator, simplifying the electronic-photonic assembly. The EAM operates in the L-band at 1590 nm, with a DC bias set at –1.6 V for on-off keying non-return to zero modulation. We measure the operation from 10 to 40 Gb/s, recording the dynamic extinction ratio from 5 to 3 dB, respectively. The use of foundry platforms does not require any fabrication process change and offers a wide spectrum of high-performance photonic-electronic integrated circuits.
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