gan基微发光二极管的激光提升性能分析

Li Sheng-Hui , Lin Chia-Ping , Fang Yen-Hsiang , Kuo Wei-Hung , Wu Ming-Hsien , Chao Chu-Li , Horng Ray-Hua , Su Guo-Dung J.
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引用次数: 9

摘要

在本研究中,采用倒装芯片技术制备了单色gan基微发光二极管(µLED)阵列。为了减小蓝宝石(n = 1.77)和氮化镓(n = 2.4)的折射率差异引起的光发散,采用了激光提升(LLO)工艺。与含有蓝宝石衬底的传统倒装芯片相比,LLO-µled显著改善了光准直性。我们特别强调LLO前后光学特性的重要性。去掉蓝宝石衬底后,光的准直度提高了12%。这些结果对于理解LLO后µLED阵列的光学特性具有重要意义。
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Performance analysis of GaN-based micro light-emitting diodes by laser lift-off process

In this study, a monochromatic GaN-based micro-light-emitting-diode (µLED) array was fabricated using flip-chip technology. The laser lift-off (LLO) process was employed to decrease the light divergence caused by the differing refractive indexes of sapphire (n = 1.77) and GaN (n = 2.4). The LLO-µLEDs considerably improve light collimation, compared with conventional flip-chip µLEDs containing a sapphire substrate. We highlight, in particular, the importance of the optical characteristics before and after LLO. Collimation of light was discovered to be 12% higher after removal of the sapphire substrate. The results are of high importance for understanding the optical properties of µLED arrays after LLO.

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