包级硅微流体冷却器与增强的射流阵列高性能3D系统

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) Pub Date : 2017-05-01 DOI:10.1109/ECTC.2017.42

Yong Han, B. L. Lau, G. Tang, Seow Meng Low, J. Goh

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引用次数: 1

摘要

设计了集微射流阵列冲击、微通道流动和微沟槽排水于一体的硅微流体冷却器，并进行了实验评价。通过消除相邻喷嘴间的负交叉流效应，实现了增强的射流阵列冲击。低热阻

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Package-Level Si Micro-Fluid Cooler with Enhanced Jet Array for High Performance 3D Systems

The Si micro-fluid cooler, combining micro-jet array impingement, micro-channel flow and micro-trench drainage, has been designed and experimentally evaluated. Enhanced jet array impingement has been achieved by eliminating the negative cross-flow effect among adjacent nozzles. Low thermal resistance

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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