用于SERS应用的3D单片金属孔板:低成本MEMS封装的展示

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) Pub Date : 2017-05-01 DOI:10.1109/ECTC.2017.93

Ning Ge, Jarrid A. Wittkopf, S. Simske, S. Barcelo, R. Ionescu, D. Lazaroff, Kevin Dooley, A. Rogacs, H. Holder

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引用次数: 2

摘要

电镀是一种低成本的工艺，通过在导电基板上施加电场使溶液中的金属离子减少。这一过程已被广泛研究，但仍然是现代技术和研发的关键。在HPinkjet印刷业务中，电镀主要用于制造用于集成打印头产品的孔板(OP)。为了扩展OP功能，开发了一种新型的具有成本效益的三维(3D) OP，以解决许多微机电系统(MEMS)应用，包括表面增强拉曼光谱(SERS)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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3D Monolithic Metal Orifice Plate for SERS Application: A Showcase of Low Cost MEMS Packaging

Electroplating is a low cost process where metal ionsin a solution are reduced by an applied electric field onto aconductive substrate. This process has been studied extensively, but is still critical for modern technology and R&D. In the HPinkjet printing business, electroplating is primarily used in themanufacturing the orifice plate (OP) for integrated print-headproducts. To extend the OP functionality, a novel cost-effectivethree-dimensional (3D) OP has been developed to addressnumerous micro-electro-mechanical systems (MEMS) applications, including surface enhanced Raman spectroscopy(SERS).

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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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