Byung-Seon Kong, Sang-Sun Lee, D. Lee, H. Choi, Hyun Woo Kim
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Electrostatic discharge failure control of IC package by epoxy molding compound modification
By changing curing accelerator and modifying the volume resistivity of epoxy molding compound (EMC), electrostatic characteristics of EMC applied package can be improved and electrostatic damage of IC device was reduced. EMC with phosphonium salt accelerator results in much lower ESD failure than EMC with phosphine salt accelerator. Because the volume resistivity of phosphonium salt applied EMC is lower than that of phosphine salt, it could easily dissipate the static electricity that generated inside of package during or after transfer molding process.
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