CBGA封装热疲劳寿命的数值与实验研究

IF 2.2 4区 工程技术 Q2 ENGINEERING, MULTIDISCIPLINARY Cmes-computer Modeling in Engineering & Sciences Pub Date : 2022-01-01 DOI:10.32604/cmes.2022.018037
Borui Yang, Jun Luo, B. Wan, Yutai Su, Guicui Fu, Xu Long
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Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages
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来源期刊
Cmes-computer Modeling in Engineering & Sciences
Cmes-computer Modeling in Engineering & Sciences ENGINEERING, MULTIDISCIPLINARY-MATHEMATICS, INTERDISCIPLINARY APPLICATIONS
CiteScore
3.80
自引率
16.70%
发文量
298
审稿时长
7.8 months
期刊介绍: This journal publishes original research papers of reasonable permanent value, in the areas of computational mechanics, computational physics, computational chemistry, and computational biology, pertinent to solids, fluids, gases, biomaterials, and other continua. Various length scales (quantum, nano, micro, meso, and macro), and various time scales ( picoseconds to hours) are of interest. Papers which deal with multi-physics problems, as well as those which deal with the interfaces of mechanics, chemistry, and biology, are particularly encouraged. New computational approaches, and more efficient algorithms, which eventually make near-real-time computations possible, are welcome. Original papers dealing with new methods such as meshless methods, and mesh-reduction methods are sought.
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