{"title":"三维堆叠集成电路中热插入的空白再分配","authors":"E. Wong, S. Lim","doi":"10.1109/ICCD.2007.4601912","DOIUrl":null,"url":null,"abstract":"One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding styles between device layers impose certain restrictions to where thermal vias may be inserted. This paper presents a whitespace redistribution algorithm that takes bonding style into consideration to improve thermal via placement, which in turn reduces temperature.","PeriodicalId":6306,"journal":{"name":"2007 25th International Conference on Computer Design","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Whitespace redistribution for thermal via insertion in 3D stacked ICs\",\"authors\":\"E. Wong, S. Lim\",\"doi\":\"10.1109/ICCD.2007.4601912\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding styles between device layers impose certain restrictions to where thermal vias may be inserted. This paper presents a whitespace redistribution algorithm that takes bonding style into consideration to improve thermal via placement, which in turn reduces temperature.\",\"PeriodicalId\":6306,\"journal\":{\"name\":\"2007 25th International Conference on Computer Design\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 25th International Conference on Computer Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICCD.2007.4601912\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 25th International Conference on Computer Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCD.2007.4601912","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Whitespace redistribution for thermal via insertion in 3D stacked ICs
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding styles between device layers impose certain restrictions to where thermal vias may be inserted. This paper presents a whitespace redistribution algorithm that takes bonding style into consideration to improve thermal via placement, which in turn reduces temperature.
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