基于液桥控制的电子冷却液桥热开关系统的设计

Su-Heon Jeong, W. Nakayama, Sung-Ki Nam, Sun-Kyu Lee
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引用次数: 1

摘要

近年来,液体桥式热交换器被认为是解决各种热问题的有效方法。液桥热开关通过调节目标区域之间的液桥来控制热阻和期望位置的温度。液桥式热开关系统由热板为上板,冷板为下板和执行器组成。“接通”状态要求,供给的液体在两板之间产生液桥,并将热量从热板传导到冷板。导热量和热阻由生成液桥的直径和高度控制。在“关闭”状态下,生成的液桥被回收并最终破裂。此时,热交换系统具有最大的热阻。这一结果减少了热传导。为了实现理想的开关操作,需要精确的液桥控制。在本研究中,通过研究液桥特性来设计热交换系统。验证了通道几何形状和间隙对液桥性能的影响,找出了液桥破裂的条件。在此基础上,设计了用于大功率LED散热系统的液桥式热开关系统。在一系列的实验中,通过设计通道的几何形状,实现了稳定的液桥运行。结果还表明,该热开关系统能够降低LED结温,调节冷热板之间的热阻。
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Design of a liquid bridge heat switch system based on the liquid bridge control for electronics cooling
Recently, liquid bridge heat switch has been suggested as effective thermal management solutions for the various thermal problems. The liquid bridge heat switch can control the thermal resistance and the temperature of desired position by regulating the liquid bridge between objective areas. The liquid bridge heat switch system is composed of hot plate as an upper plate, cold plate as a lower plate, and actuators. “On” state demand, the supplied liquid generates liquid bridge between two plates and conducts heat from hot plate to cold plate. The amount of conducting heat and thermal resistance are controlled by the diameter and height of generated liquid bridge. To be an “Off” state, the generated liquid bridge is retrieved and ruptured eventually. At that time, the heat switch system has maximum thermal resistance. This result decreased conduction of heat. In order to realize the desired switch operation, the precise liquid bridge control is required. In this research, the liquid bridge behavior was studied to design the heat switch system. The effects of channel geometry and clearance on the liquid bridge behavior were verified and the liquid bridge rupture conditions were found out. Based on the investigation, the liquid bridge heat switch system was designed for the high power LED cooling system. In a series of experiment, the stable liquid bridge operation was achieved by designed channel geometry. The results also showed that proposed heat switch system was able to decrease the LED junction temperature and regulate the thermal resistance between hot and cold plate.
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Parasitic electrical and electromagnetic effects Heat management Passive electronic components Interconnection technology Reliability and maintainability
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