陶瓷层压板的残余应力分布

M. Ortolani, M. Leoni, P. Scardi, M. Golshan
{"title":"陶瓷层压板的残余应力分布","authors":"M. Ortolani, M. Leoni, P. Scardi, M. Golshan","doi":"10.1524/ZKRI.2007.2007.SUPPL_26.91","DOIUrl":null,"url":null,"abstract":"Abstract. Tape casting followed by high temperature compaction and sintering can be used for the production of ceramic laminates with a very high fracture toughness compared to their bulk counterpart. These enhanced properties can be obtained by suitable choice of the layers to be co-sintered in order to obtain a particular residual stress profile in the final com-ponent. The stress profile can be accurately measured by means of synchrotron radiation diffraction in energy-dispersive fixed-gauge-volume setup. The data for a set of alu-mina/zirconia/mullite laminates of ca. 1mm thickness, made of layers as thin as ca. 40μm are here presented and the results compared with theoretical predictions. In addition to the aver-age stress profile, diffraction allowed to establish the stress in each of the different phases constituting the layers, thus showing coupling between the grains present therein. Introduction Traditional ceramic materials usually show brittle behaviour and low toughness. Strength values are highly scattered, as they strongly depend on the presence of defects such as cracks and scratches, introduced by the manufacturing process. Therefore, as the characteristics of such defects are heavily dependent on the conditions the material has undergone, the material has very low reliability because the fracture point is far from being clearly definite [1,2]. In order to enhance the strength of such materials, a possibility is to inhibit, limit or suitably guide crack propagation. Several techniques have been proposed to achieve this goal [3,4]. The simplest one is to create a low-energy path for crack advancement by adding soft or porous layers. There is no actual increase in strength but elongation and toughness increase significantly. Also, the material shows clear signals of imminent rupture before this happens. A smarter solution is to exploit a designed residual stress profile in the material [5,6]. If a compressive residual stress is introduced near the surface, then cracks must overcome the stored elastic energy barrier in order to propagate: the same principle is used to enhance the resistance properties of glass components (tempered glass). To achieve this, the traditional material is transformed into a","PeriodicalId":23897,"journal":{"name":"Zeitschrift Fur Kristallographie","volume":"168 1","pages":"91-96"},"PeriodicalIF":0.0000,"publicationDate":"2007-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Residual stress profile in ceramic laminates\",\"authors\":\"M. Ortolani, M. Leoni, P. Scardi, M. Golshan\",\"doi\":\"10.1524/ZKRI.2007.2007.SUPPL_26.91\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Abstract. Tape casting followed by high temperature compaction and sintering can be used for the production of ceramic laminates with a very high fracture toughness compared to their bulk counterpart. These enhanced properties can be obtained by suitable choice of the layers to be co-sintered in order to obtain a particular residual stress profile in the final com-ponent. The stress profile can be accurately measured by means of synchrotron radiation diffraction in energy-dispersive fixed-gauge-volume setup. The data for a set of alu-mina/zirconia/mullite laminates of ca. 1mm thickness, made of layers as thin as ca. 40μm are here presented and the results compared with theoretical predictions. In addition to the aver-age stress profile, diffraction allowed to establish the stress in each of the different phases constituting the layers, thus showing coupling between the grains present therein. Introduction Traditional ceramic materials usually show brittle behaviour and low toughness. Strength values are highly scattered, as they strongly depend on the presence of defects such as cracks and scratches, introduced by the manufacturing process. Therefore, as the characteristics of such defects are heavily dependent on the conditions the material has undergone, the material has very low reliability because the fracture point is far from being clearly definite [1,2]. In order to enhance the strength of such materials, a possibility is to inhibit, limit or suitably guide crack propagation. Several techniques have been proposed to achieve this goal [3,4]. The simplest one is to create a low-energy path for crack advancement by adding soft or porous layers. There is no actual increase in strength but elongation and toughness increase significantly. Also, the material shows clear signals of imminent rupture before this happens. A smarter solution is to exploit a designed residual stress profile in the material [5,6]. If a compressive residual stress is introduced near the surface, then cracks must overcome the stored elastic energy barrier in order to propagate: the same principle is used to enhance the resistance properties of glass components (tempered glass). To achieve this, the traditional material is transformed into a\",\"PeriodicalId\":23897,\"journal\":{\"name\":\"Zeitschrift Fur Kristallographie\",\"volume\":\"168 1\",\"pages\":\"91-96\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Zeitschrift Fur Kristallographie\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1524/ZKRI.2007.2007.SUPPL_26.91\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"Chemistry\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Zeitschrift Fur Kristallographie","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1524/ZKRI.2007.2007.SUPPL_26.91","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"Chemistry","Score":null,"Total":0}
引用次数: 2

摘要

摘要带铸造,然后是高温压实和烧结,可用于陶瓷层压板的生产,与它们的块状对应物相比,具有非常高的断裂韧性。这些增强的性能可以通过适当选择共烧结层来获得,以便在最终部件中获得特定的残余应力分布。在能量色散固定计体积装置中,同步辐射衍射可以精确测量应力剖面。本文给出了一组厚度约为1mm的氧化铝/氧化锆/莫来石层压板的数据,其层厚约为40μm,并与理论预测结果进行了比较。除了平均年龄应力分布外,衍射还可以确定构成层的每个不同相中的应力,从而显示其中存在的晶粒之间的耦合。传统陶瓷材料通常表现为脆性和低韧性。强度值是高度分散的,因为它们强烈依赖于由制造过程引入的裂纹和划痕等缺陷的存在。因此,由于这些缺陷的特征很大程度上取决于材料所经历的条件,因此材料的可靠性很低,因为断裂点远没有明确确定[1,2]。为了提高这类材料的强度,一种可能是抑制、限制或适当引导裂纹扩展。已经提出了几种技术来实现这一目标[3,4]。最简单的一种方法是通过添加软层或多孔层来创造一个低能量的裂缝发展路径。强度实际上没有增加,但伸长率和韧性显著增加。此外,在这种情况发生之前,这种材料显示出即将破裂的明确信号。一个更聪明的解决方案是利用材料中设计的残余应力分布[5,6]。如果在表面附近引入压缩残余应力,那么裂缝必须克服存储的弹性能垒,以便传播:同样的原理用于增强玻璃组件(钢化玻璃)的电阻性能。为了实现这一目标,传统材料被转化为
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Residual stress profile in ceramic laminates
Abstract. Tape casting followed by high temperature compaction and sintering can be used for the production of ceramic laminates with a very high fracture toughness compared to their bulk counterpart. These enhanced properties can be obtained by suitable choice of the layers to be co-sintered in order to obtain a particular residual stress profile in the final com-ponent. The stress profile can be accurately measured by means of synchrotron radiation diffraction in energy-dispersive fixed-gauge-volume setup. The data for a set of alu-mina/zirconia/mullite laminates of ca. 1mm thickness, made of layers as thin as ca. 40μm are here presented and the results compared with theoretical predictions. In addition to the aver-age stress profile, diffraction allowed to establish the stress in each of the different phases constituting the layers, thus showing coupling between the grains present therein. Introduction Traditional ceramic materials usually show brittle behaviour and low toughness. Strength values are highly scattered, as they strongly depend on the presence of defects such as cracks and scratches, introduced by the manufacturing process. Therefore, as the characteristics of such defects are heavily dependent on the conditions the material has undergone, the material has very low reliability because the fracture point is far from being clearly definite [1,2]. In order to enhance the strength of such materials, a possibility is to inhibit, limit or suitably guide crack propagation. Several techniques have been proposed to achieve this goal [3,4]. The simplest one is to create a low-energy path for crack advancement by adding soft or porous layers. There is no actual increase in strength but elongation and toughness increase significantly. Also, the material shows clear signals of imminent rupture before this happens. A smarter solution is to exploit a designed residual stress profile in the material [5,6]. If a compressive residual stress is introduced near the surface, then cracks must overcome the stored elastic energy barrier in order to propagate: the same principle is used to enhance the resistance properties of glass components (tempered glass). To achieve this, the traditional material is transformed into a
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
CiteScore
1.47
自引率
0.00%
发文量
0
审稿时长
3 months
期刊介绍: Zeitschrift für Kristallographie International journal for structural, physical, and chemical aspects of crystalline materials ISSN 0044-2968 Founded in 1877 by Paul Groth Zeitschrift für Kristallographie is one of the world’s oldest scientific journals. In original papers, letters and review articles it presents results of theoretical or experimental study on crystallography.
期刊最新文献
POWGEN: a third-generation high resolution high-throughput powder diffraction instrument at the Spallation Neutron Source Diffraction contrast factor of dislocations: The case of scheelite CaWO4 Nanocrystalline MgO powder materials prepared by sol-gel studied by X-ray diffraction and electron microscopy Macromolecular powder diffraction : structure solution via molecular. Interdiffusion and stress development in Ni-Cu thin film diffusion couples
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1