中空玻璃微球填充水泥复合材料的热行为模拟

Hui Wang, F. Hou, Xin-Juan Zhao
{"title":"中空玻璃微球填充水泥复合材料的热行为模拟","authors":"Hui Wang, F. Hou, Xin-Juan Zhao","doi":"10.7726/AJMST.2015.1001","DOIUrl":null,"url":null,"abstract":"In this paper, thermal behavior in cement composites filled with hollow glass microspheres was modeled by finite element method based on heat conduction theory. According to experimental observation of the microsphere distribution in the cement matrix material by the scanning electron microscope, a twodimensional unite cell including single hollow glass microsphere and cement material phase is chosen as the computational model, in which the specified temperature conditions are applied on the opposite edges of the cell to model heat transfer in the cell by finite element simulation. The effects of volume content and wall thickness of the microsphere, thermal conductivities of the wall and the cement on the effective thermal conductivity of the composite are investigated. Numerical results demonstrate that the developing lightweight cement-based composite can have significant lower thermal conductivity than the cement matrix itself by introducing the hollow glass microsphere.","PeriodicalId":7420,"journal":{"name":"American Journal of Materials Science","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2015-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Simulation of Thermal Behavior in Hollow-glass-microsphere-filled Cement Composites\",\"authors\":\"Hui Wang, F. Hou, Xin-Juan Zhao\",\"doi\":\"10.7726/AJMST.2015.1001\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, thermal behavior in cement composites filled with hollow glass microspheres was modeled by finite element method based on heat conduction theory. According to experimental observation of the microsphere distribution in the cement matrix material by the scanning electron microscope, a twodimensional unite cell including single hollow glass microsphere and cement material phase is chosen as the computational model, in which the specified temperature conditions are applied on the opposite edges of the cell to model heat transfer in the cell by finite element simulation. The effects of volume content and wall thickness of the microsphere, thermal conductivities of the wall and the cement on the effective thermal conductivity of the composite are investigated. Numerical results demonstrate that the developing lightweight cement-based composite can have significant lower thermal conductivity than the cement matrix itself by introducing the hollow glass microsphere.\",\"PeriodicalId\":7420,\"journal\":{\"name\":\"American Journal of Materials Science\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"American Journal of Materials Science\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.7726/AJMST.2015.1001\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"American Journal of Materials Science","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.7726/AJMST.2015.1001","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

本文采用基于热传导理论的有限元方法,模拟了中空玻璃微球填充水泥复合材料的热行为。根据用扫描电镜对微球在水泥基体材料中的分布进行实验观察,选择一个包含单个中空玻璃微球和水泥材料相的二维统一池作为计算模型,在池的相对边缘施加特定的温度条件,通过有限元模拟模拟池内的传热。研究了微球体积含量、微球壁厚、微球壁热导率和水泥热导率对复合材料有效导热系数的影响。数值结果表明,引入中空玻璃微球后,所制备的轻质水泥基复合材料的导热系数明显低于水泥基体本身。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Simulation of Thermal Behavior in Hollow-glass-microsphere-filled Cement Composites
In this paper, thermal behavior in cement composites filled with hollow glass microspheres was modeled by finite element method based on heat conduction theory. According to experimental observation of the microsphere distribution in the cement matrix material by the scanning electron microscope, a twodimensional unite cell including single hollow glass microsphere and cement material phase is chosen as the computational model, in which the specified temperature conditions are applied on the opposite edges of the cell to model heat transfer in the cell by finite element simulation. The effects of volume content and wall thickness of the microsphere, thermal conductivities of the wall and the cement on the effective thermal conductivity of the composite are investigated. Numerical results demonstrate that the developing lightweight cement-based composite can have significant lower thermal conductivity than the cement matrix itself by introducing the hollow glass microsphere.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A comparison of microstructural, mechanical and tribological properties of WC-10Co4Cr - HVOF coating and hard chrome to use in hydraulic cylinders AHP-DENG’S Similarity Based Optimization of WEDM Process Parameters of Al/SiCp Composite History and manufacturing of glass Assessment of Thermo-Mechanically Treated Chicken Feather Fibre Reinforced Epoxy Composites for Automobile Application Evaluation of Shear Resistance of Bolted Connections in Wood/Wood and Wood/Steel Plate/Wood
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1