激光粉末床熔合制造元件应变片的集成

M. Binder, Martina Fischer, S. Dietrich, C. Seidel, G. Reinhart
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引用次数: 3

摘要

通过增材制造(AM)技术制造的产品组件中传感器的集成为实时监控提供了新的可能性。到目前为止,机械力监测(如压缩和应变)都是通过粘接或焊接固定在部件表面的应变片(SG)来进行的。这种传统的方法有一个关键的缺点:安装在组件表面的SG不能提供关于组件内部力的任何信息,并且暴露在周围环境的影响下。由于am部件的分层构建,传感器可以集成在部件内,因此可以克服这些缺点。但是,对于金属加工am技术来说,通常使用的粘合剂粘接存在工艺温度高、固化时间长等问题。因此,本研究描述了SG集成的焊接方法,其中通过在SG和am组件之间应用焊缝来创建力传递的牢固融合。由于焊接是在金属加工激光粉末床熔化过程(PBF-LB/M)中进行的,因此不需要对组件进行额外的固定,例如胶水。在介绍了SG集成过程之后,进行了分析,以确定测试体的载荷如何与集成SG的数据相对应。结果表明,在PBF-LB/M过程中集成SGs的可能性有助于克服传统传感器安装概念的缺点。可以确保SG集成过程的顺利进行,从而使未来的研究重点放在该过程的自动化上。
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Integration of Strain Gauges in Components Manufactured by Laser-Based Powder Bed Fusion
The integration of sensors within product components manufactured by additive manufacturing (AM) techniques promises auspicious new possibilities for real time monitoring. Until now, mechanical force monitoring such as compression and strain has been carried out using strain gauges (SG) fixed to the surface of the component by glued or weld-on bonding. This conventional approach has crucial disadvantages: an SG mounted on the component surface does not provide any information about the forces inside the component and is exposed to the surrounding environmental influences.

Due to the layered build-up of AM-parts sensors can be integrated within the part and therefore these drawbacks be overcome. But the usually used adhesive bonding presents challenges for metalworking AM-Techniques regarding the high process temperatures and the curing times of the used glues.

Therefore, this study describes a weld-on method for SG integration where the firm fusion for force transmission is created by applying weld seams between the SG and the AM-component. Since the welding is performed during the metalworking laser-based powder bed fusion process (PBF-LB/M) no additional fixing of the component, e.g. glue, is necessary. After presentation of an SG integration process, an analysis is performed to determine how the load of a test body corresponds to the data of the integrated SG. The results show that the possibility of integrating SGs during the PBF-LB/M process helps in overcoming the disadvantages of conventional sensor mounting concepts. A smooth SG integration process can be ensured allowing future research to focus on automating this process.
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