一种预测基底和电触点金属化系统腐蚀过程的新方法

S. Klengel, Tino Stpehan, U. Spohn
{"title":"一种预测基底和电触点金属化系统腐蚀过程的新方法","authors":"S. Klengel, Tino Stpehan, U. Spohn","doi":"10.1109/ECTC.2017.139","DOIUrl":null,"url":null,"abstract":"We developed a method based on cyclic voltammetrically measurements which allows corrosion sensitivity analyzes of typical metallization systems for substrates and electrical contacts in a very short time. Using a new electrolyte with innovative composition enables to combine the aggressive impact of the three standard tests in one procedure and initiates typical application related corrosion processes. Additionally the method allows quantitative results for the specimen tested. In this paper we will present and discuss the new method for corrosion testing in correlation to standard reliability tests, like mixed flow gas testing (MFG). Furthermore high resolution microstructural analyzes after standard reliability testing as well as after cyclic voltammetrically investigation are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyzes (EDS) for samples after standard testing and after applying the new test method. Finally the corrosion processes induced by the different tests will be compared and discussed.","PeriodicalId":6557,"journal":{"name":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","volume":"2 1","pages":"1165-1170"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A New Method for Prediction of Corrosion Processes in Metallization Systems for Substrates and Electrical Contacts\",\"authors\":\"S. Klengel, Tino Stpehan, U. Spohn\",\"doi\":\"10.1109/ECTC.2017.139\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We developed a method based on cyclic voltammetrically measurements which allows corrosion sensitivity analyzes of typical metallization systems for substrates and electrical contacts in a very short time. Using a new electrolyte with innovative composition enables to combine the aggressive impact of the three standard tests in one procedure and initiates typical application related corrosion processes. Additionally the method allows quantitative results for the specimen tested. In this paper we will present and discuss the new method for corrosion testing in correlation to standard reliability tests, like mixed flow gas testing (MFG). Furthermore high resolution microstructural analyzes after standard reliability testing as well as after cyclic voltammetrically investigation are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyzes (EDS) for samples after standard testing and after applying the new test method. Finally the corrosion processes induced by the different tests will be compared and discussed.\",\"PeriodicalId\":6557,\"journal\":{\"name\":\"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"2 1\",\"pages\":\"1165-1170\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2017.139\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE 67th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2017.139","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

我们开发了一种基于循环伏安测量的方法,可以在很短的时间内对基片和电触点的典型金属化系统进行腐蚀敏感性分析。使用具有创新成分的新型电解质,可以在一个程序中结合三种标准测试的侵略性影响,并启动典型的应用相关腐蚀过程。此外,该方法允许对所测试的试样进行定量分析。在本文中,我们将提出并讨论与标准可靠性试验,如混合流气体试验(MFG)相关联的腐蚀试验的新方法。此外,通过标准可靠性试验和循环伏安试验对其进行了高分辨显微组织分析,为其运行腐蚀机理提供了依据。我们将展示标准测试和应用新测试方法后样品的扫描电子显微镜(SEM)和元素分析(EDS)结果。最后对不同试验引起的腐蚀过程进行了比较和讨论。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A New Method for Prediction of Corrosion Processes in Metallization Systems for Substrates and Electrical Contacts
We developed a method based on cyclic voltammetrically measurements which allows corrosion sensitivity analyzes of typical metallization systems for substrates and electrical contacts in a very short time. Using a new electrolyte with innovative composition enables to combine the aggressive impact of the three standard tests in one procedure and initiates typical application related corrosion processes. Additionally the method allows quantitative results for the specimen tested. In this paper we will present and discuss the new method for corrosion testing in correlation to standard reliability tests, like mixed flow gas testing (MFG). Furthermore high resolution microstructural analyzes after standard reliability testing as well as after cyclic voltammetrically investigation are giving evidence for the running corrosion mechanism. We will show results of Scanning Electron Microscopy (SEM) and element analyzes (EDS) for samples after standard testing and after applying the new test method. Finally the corrosion processes induced by the different tests will be compared and discussed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Peridynamic Solution of Wetness Equation with Time Dependent Saturated Concentration in ANSYS Framework Axially Tapered Circular Core Polymer Optical Waveguides Enabling Highly Efficient Light Coupling Low Loss Channel-Shuffling Polymer Waveguides: Design and Fabrication Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application 3D Packaging of Embedded Opto-Electronic Die and CMOS IC Based on Wet Etched Silicon Interposer
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1