利用带有数字体积相关的x射线微ct数据建立有限元模型和测量引信电子元件的内部变形

P. Lall, Nakul Kothari, John Deep, J. Foley, Ryan Lowe
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引用次数: 3

摘要

电子引信组件在长期储存、运输和部署过程中可能暴露在恶劣的环境中。在暴露于储存-运输环境负荷下,包括机械冲击、温度、振动和湿度,引信组件可能会遭受损坏,而表面没有任何明显的退化迹象。此外,操作环境要求在通常超过10,000g的高g负载下的生存能力。对非破坏性测试方法的需求是非常可取的,这种方法可以确定内部损伤,并在长期储存造成累积损伤的情况下评估预期的操作可靠性。虽然目前存在一些无损检测方法,如x射线和声成像,但它们仅限于获取内部损伤状态的成像,而无法测量环境载荷作用下的变形。本文提出了一种利用x射线微计算机断层扫描数据建立有限元模型的新方法。此外,还提出了一种方法,用于测量引信组件在暴露于操作机械冲击之前和之后的环境温度梯度作用下的内部变形,该方法使用x射线微计算机断层扫描和数字体积相关的组合。
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Development of FE Models and Measurement of Internal Deformations of Fuze Electronics Using X-Ray MicroCT Data with Digital Volume Correlation
Electronic fuze assemblies may be exposed to harsh environments during prolonged storage, transport and deployment. Under exposure to storage-transport environmental loads including mechanical shock, temperature, vibration and humidity the fuze assemblies may sustain damage without any surface signs of visible degradation. Further, the operational environment requires survivability under high-g loads often in excess of 10,000g. The need for non-destructive test methods to allow for determination of the internal damage and the assessment of expected operational reliability under the presence of accrued damage from prolonged storage is extremely desirable. While a number of non-destructive test methods such as x-ray, and acoustic imaging exist in the state-of-art – they are limited to the acquisition of imaging of the internal damage state without the ability of conducting measurement of deformation under the action of environment loads. In this paper, a new method has been presented for the creation of the finite element models using x-ray micro-computed tomography data. Further, a method has been presented for measurement of internal deformation in fuze assemblies under the action of environment temperature gradients prior to and subsequent to exposure to operational mechanical shock using a combination of x-ray micro-computed tomography and digital volume correlation.
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