低自旋密度非晶氢化硅的缺陷平衡和亚稳态

T.J. McMahon
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引用次数: 12

摘要

利用电子自旋共振表征了60 μm厚氢化非晶硅薄膜在室温至280℃范围内的热平衡缺陷浓度。在190℃下,1×1015cm−3自旋的材料缺陷形成能为0.35 eV。250℃淬火后,缺陷的活化能为2.2 eV。比较了缺陷在250℃和190℃淬火时的150℃退火情况;在较高温度下引入的额外缺陷退火速度快10倍,支持具有较高地层能的亚稳态具有较小退火活化能的模型。光致缺陷被描述为一种非常“高温”的分布,类似于由于kT≈0.5 eV而可能被淬灭的分布。
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Defect equilibration and metastability in low-spin-density amorphous hydrogenated silicon

Electron spin resonance was used to characterize concentrations of thermal equilibrium defects from room temperature to 280 °C in a 60 μm thick hydrogenated amorphous silicon film. A defect formation energy of 0.35 eV was found in material with 1×1015cm−3 spins at 190 °C. Annealing of defects quenched in from 250 °C revealed an activation energy of 2.2 eV. Annealings at 150 °C of defects quenched in at 250 °C and 190 °C were compared; the additional defects introduced at the higher temperature annealed 10 times faster, supporting a model in which metastable states with higher formation energies have smaller annealing activation energies. Light-induced defects are described in terms of a very “high-temperature” distribution similar to that which might be quenched in as a result of kT ≈ 0.5 eV.

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