聚合物-碳纳米管复合材料强化的“半导体”模型

Karachevtseva Liudmyla, Kartel Mykola, W. Bo, Lytvynenko Oleg, Onyshchenko Volodymyr, S. Yurii, Trachevskyi Viacheslav
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摘要

我们分析了“聚合物-碳纳米管”复合材料在300 K和低(0.1-0.5)wt%碳纳米管浓度下强化的“半导体”模型。碳纳米管是已知的最具各向异性的材料之一,具有极高的杨氏模量值。研究了振动键对多壁碳纳米管聚乙烯亚胺、聚酰胺、聚丙烯和橡胶复合薄膜中聚合物结晶和强化的影响。复合材料“聚乙烯亚胺-碳纳米管”形成后的红外吸光度最大值出现在聚乙烯亚胺的sp3杂化键频率处的光谱区域。γω(CН)和γω(CH2)振动决定了聚丙烯、聚酰胺-6与碳纳米管的sp3杂化键在光谱区域的高红外吸收。我们测量了复合材料“橡胶-碳纳米管”在CH价态和变形振动光谱区域的最大红外反射率。根据复合材料结构的“半导体”模型,纳米管电子与聚合物中质子之间的电场扩散方程的红外峰依赖关系符合一维高斯曲线。对于我们的长效几百纳米相互作用的例子,根据半导体n-p模型,聚合物的结晶取决于sp3 C-C键在本征电场中的组织。当CNTs含量为0.25%时,聚酰胺-6复合材料的抗拉强度增加1.7倍,拉伸变形增加2.3倍。
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“Semiconductor” Model of the “Polymer-CNTs” Composite Strengthening
We analyzed “semiconductor” model of the “polymer-CNTs” composite strengthening at 300 K and low (0.1-0.5) wt% CNTs concentration. Carbon nanotubes are among the most anisotropic materials known and have extremely high values of Young's modulus. We investigated influence of vibration bonds on polymer crystallization and strengthening in composite films of polyethylenimine, polyamide, polypropylene and rubber with multiwall carbon nanotubes. IR absorbance maxima we evaluated after formation of composite “polyethylenimine-carbon nanotube” in the spectral area of the sp3 hybridization bonds at the frequency of primary amino groups of polyethylenimine. High IR absorption in the spectral area of sp3 hybridization bonds of polypropylene, polyamide-6 with carbon nanotubes is determined by γω(CН) and γω(CH2) vibrations. We measured IR reflectance maxima of composite “rubber-carbon nanotube” in the spectral area of CH valence and deformation vibrations. The IR peak dependence on the carbon nanotube content corresponds to 1D Gaussian curve for the diffusion equation in the electric field between electrons of nanotubes and protons in polymer according to “semiconductor” model of the composite structuring. For our case of the long-acting hundreds nanometer interactions, the polymer crystallization depends on sp3 C-C bonds organization in the intrinsic electric field according to the semiconductor n-p model. Tensile strength for polyamide-6 composites at 0.25% CNTs increases 1.7 times and tensile deformation – 2.3 times.
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