CdTe沉积温度对不同tco和玻璃基板器件性能的影响

R. Dhere, M. Bonnet-eymard, Emilie Charlet, E. Peter, J. Duenow, H. Moutinho, Jian V. Li, M. Scott, D. Albin, T. Gessert
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引用次数: 3

摘要

在本文中,我们介绍了我们在衬底温度范围为450°至620°c的近间隔升华沉积的CdTe薄膜制备器件的工作。我们研究了在圣戈班钠石灰SGG钻石和康宁7059硼硅酸盐玻璃衬底上制备的器件。我们使用了四种类型的触点:SnO2:F, ITO, CTO和Saint-Gobain AZO,有和没有高电阻率缓冲层。我们使用了多种缓冲层:未掺杂的SnO2,氧化锌锡(ZTO)和专有的Saint-Gobain缓冲层。缓冲层对于使用CTO和AZO作为前触点的器件至关重要。对于圣戈班开发的AZO层,我们在没有缓冲层的情况下实现了9%的效率,当CdTe膜沉积在500℃以下时,我们实现了超过12%的效率。我们使用标准电流密度电压和量子效率分析来确定器件参数。
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The effect of CdTe deposition temperature on device properties of different TCOs and glass substrates
In this paper, we present our work on devices fabricated using CdTe films deposited by close-spaced sublimation using substrate temperatures in the range of 450° to 620° C. We studied devices prepared on Saint-Gobain soda lime SGG Diamant and Corning 7059 borosilicate glass substrates. We used four types of contact: SnO2:F, ITO, CTO, and Saint-Gobain AZO with and without high-resistivity buffer layers. We used a variety of buffer layers: undoped SnO2, zinc tin oxide (ZTO), and proprietary Saint-Gobain buffer layers. A buffer layer is crucial for devices using CTO and AZO as the front contact. For AZO layers developed by Saint-Gobain, we achieved 9% efficiency without a buffer layer and over 12% efficiency using buffer layers when CdTe films are deposited below 500° C. We used standard current density-voltage and quantum efficiency analysis to determine the device parameters.
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