{"title":"高密度单片6×30 Gb/s可调WDM发射机,通用III-V平台","authors":"W. Yao, M. Smit, M. Wale","doi":"10.1109/CLEOPR.2017.8118940","DOIUrl":null,"url":null,"abstract":"We present the design and measurement of a high-density WDM transmitter from a simple, low-cost generic photonic foundry. Monolithic integration of active and passive devices on InP yields a compact circuit with 20 nm tuneability and 30 Gb/s modulation per channel. This results in a chip supporting 180 Gb/s with a high capacity density of 10 Gb/s/mm2.","PeriodicalId":6655,"journal":{"name":"2017 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR)","volume":"1 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2017-07-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"High-density monolithic 6×30 Gb/s tunable WDM transmitter in generic III-V platform\",\"authors\":\"W. Yao, M. Smit, M. Wale\",\"doi\":\"10.1109/CLEOPR.2017.8118940\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present the design and measurement of a high-density WDM transmitter from a simple, low-cost generic photonic foundry. Monolithic integration of active and passive devices on InP yields a compact circuit with 20 nm tuneability and 30 Gb/s modulation per channel. This results in a chip supporting 180 Gb/s with a high capacity density of 10 Gb/s/mm2.\",\"PeriodicalId\":6655,\"journal\":{\"name\":\"2017 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR)\",\"volume\":\"1 1\",\"pages\":\"1-2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-07-31\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CLEOPR.2017.8118940\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CLEOPR.2017.8118940","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We present the design and measurement of a high-density WDM transmitter from a simple, low-cost generic photonic foundry. Monolithic integration of active and passive devices on InP yields a compact circuit with 20 nm tuneability and 30 Gb/s modulation per channel. This results in a chip supporting 180 Gb/s with a high capacity density of 10 Gb/s/mm2.