氢化非晶硅p-i-n器件中复合的电致发光研究

K. Wang, D. Han, M. Silver, H.M. Branz
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引用次数: 5

摘要

我们提供了氢化非晶硅(a-Si:H) p-i-n结构中电致发光和正向偏置电流依赖于电压和温度(80<T<300 K)的实验数据。由于电子和空穴是从样品的相对侧注入的,因此我们能够探测实际器件结构的内禀层中的非双相辐射和非辐射复合过程。我们发现电致发光实验中的有效产生率与施加电压的平方成正比,因为辐射复合率与双注入电子密度成正比。一个简单的电子复合率模型解释了这些数据。非辐射复合速率与温度有关,而辐射复合速率与温度无关。
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Electroluminescence studies of recombination in hydrogenated amorphous silicon p-i-n devices

We present experimental data on the voltage and temperature (80<T<300 K) dependence of electroluminescence and forward bias current in hydrogenated amorphous silicon (a-Si:H) p-i-n structures. Since electrons and holes are injected from opposite sides of the sample, we are able to probe non-geminate radiative and non-radiative recombination processes in the intrinsic layer of actual device structures. We find that the effective generation rate in the electroluminescence experiment is proportional to the square of the applied voltage because the radiative recombination rate is proportional to the double-injection electron density. A simple model of electron recombination rates explains the data. The non-radiative recombination rate was found to be temperature dependent, but the radiative recombination rate is temperature independent.

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