T. Barbier, D. Caban-Chastas, V. Rananjason, P. Kertesz
{"title":"用于MMIC封装的宽带有机解决方案","authors":"T. Barbier, D. Caban-Chastas, V. Rananjason, P. Kertesz","doi":"10.1109/MWSYM.2005.1517179","DOIUrl":null,"url":null,"abstract":"This paper describes packages solutions developed to integrate MMICs which operate from 2GHz to 20GHz. These chip scale nonhermetic packages are made up of organic based material and are dedicated to assembly onto organic multilayers. Three solutions are presented, two involving ball grid array (BGA) interfaces, and one using a lead frame for thermal dissipation requirements. This last one enables to integrate high power dissipation (about 10W) MMIC. The RF transition improvement is described and performance obtained by measuring packaged MMICs with these solutions is presented. Environmental evaluation results are discussed for the based lead frame interface package. Finally, a 3D package taking benefits from the solutions firstly developed is presented.","PeriodicalId":13133,"journal":{"name":"IEEE MTT-S International Microwave Symposium Digest, 2005.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2005-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Wide band organic solutions for MMIC packaging\",\"authors\":\"T. Barbier, D. Caban-Chastas, V. Rananjason, P. Kertesz\",\"doi\":\"10.1109/MWSYM.2005.1517179\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes packages solutions developed to integrate MMICs which operate from 2GHz to 20GHz. These chip scale nonhermetic packages are made up of organic based material and are dedicated to assembly onto organic multilayers. Three solutions are presented, two involving ball grid array (BGA) interfaces, and one using a lead frame for thermal dissipation requirements. This last one enables to integrate high power dissipation (about 10W) MMIC. The RF transition improvement is described and performance obtained by measuring packaged MMICs with these solutions is presented. Environmental evaluation results are discussed for the based lead frame interface package. Finally, a 3D package taking benefits from the solutions firstly developed is presented.\",\"PeriodicalId\":13133,\"journal\":{\"name\":\"IEEE MTT-S International Microwave Symposium Digest, 2005.\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-06-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE MTT-S International Microwave Symposium Digest, 2005.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2005.1517179\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE MTT-S International Microwave Symposium Digest, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2005.1517179","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper describes packages solutions developed to integrate MMICs which operate from 2GHz to 20GHz. These chip scale nonhermetic packages are made up of organic based material and are dedicated to assembly onto organic multilayers. Three solutions are presented, two involving ball grid array (BGA) interfaces, and one using a lead frame for thermal dissipation requirements. This last one enables to integrate high power dissipation (about 10W) MMIC. The RF transition improvement is described and performance obtained by measuring packaged MMICs with these solutions is presented. Environmental evaluation results are discussed for the based lead frame interface package. Finally, a 3D package taking benefits from the solutions firstly developed is presented.
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