Wetting Behavior of Reactive and Non–Reactive Wetting of Liquids on Metallic Substrates

Wetting characteristics of reactive (Sn–0.7Cu solder) and non– reactive (castor oil) wetting of liquids on Cu and Ag plated Al substrates have been investigated. Solder spreading exhibited capillary, gravity and viscous regimes. Oils did not exhibit noticeable spreading regimes. Solder alloy showed better wettability on Ag coated Al substrate compared to Cu plating. In the case of castor oil, Cu coated Al substrate exhibited good wettability as compared to Ag coated Al substrates. The difference in wettability during reactive wetting of solder and non–reactive wetting of oils is attributed to the change in the surface energies of Al substrates brought about by the formation of intermetallic compounds (IMCs). Keywords—Wettability, contact angle, solder, castor oil, IMCs.