L. Sudakov-Boreysha, A. Morgenshtein, U. Dinnar, Y. Nemirovsky
{"title":"ISFET CMOS兼容设计和封装挑战","authors":"L. Sudakov-Boreysha, A. Morgenshtein, U. Dinnar, Y. Nemirovsky","doi":"10.1109/ICECS.2004.1399736","DOIUrl":null,"url":null,"abstract":"This work presents the main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.","PeriodicalId":38467,"journal":{"name":"Giornale di Storia Costituzionale","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"ISFET CMOS compatible design and encapsulation challenges\",\"authors\":\"L. Sudakov-Boreysha, A. Morgenshtein, U. Dinnar, Y. Nemirovsky\",\"doi\":\"10.1109/ICECS.2004.1399736\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This work presents the main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.\",\"PeriodicalId\":38467,\"journal\":{\"name\":\"Giornale di Storia Costituzionale\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Giornale di Storia Costituzionale\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICECS.2004.1399736\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"Arts and Humanities\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Giornale di Storia Costituzionale","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICECS.2004.1399736","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Arts and Humanities","Score":null,"Total":0}
ISFET CMOS compatible design and encapsulation challenges
This work presents the main challenges in ISFET encapsulation. It analyzes SU8 drawbacks as an encapsulant and presents a novel flip-chip bonding packaging concept.
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