微细银片填充二羧酸改性导电胶粘剂的电学性能

Jie-Fei Zhu, Hong Jin, Min-bo Zhou, Xin-Ping Zhang
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引用次数: 5

摘要

在本研究中,选择几种传统的二羧酸(如草酸、丙二酸、琥珀酸、己二酸和戊二酸)来修饰填充微银片的导电胶粘剂(ECAs),并制备了相应的导电胶粘剂。在这样设计和制备的ECAs中,二羧酸通过原位取代表面活性剂来起作用,从而改善银片的接触和分布,从而提高ECAs的电学性能。用差示扫描量热计表征了加入不同二羧酸后制备的ECAs的固化行为,用高速可编程微欧姆计测定了ECAs的体电阻率,并用扫描电镜分析了ECAs的形貌。结果表明,己二酸可以作为一种很好的添加剂,不仅可以促进ECAs的固化,明显提高反应热,还可以改善ECAs的电学性能,显著降低其体积电阻率。
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Electrical property of electrically conductive adhesives filled with micro-sized Ag flakes and modified by dicarboxylic acids
In the present study, several conventional dicarboxylic acids (e.g., oxalic acid, malonic acid, succinic acid, adipic acid and glutaric acid) are selected to modify electrically conductive adhesives (ECAs) filled with micro-sized silver flakes, and so-designed ECAs have been prepared. In so-designed and prepared ECAs, dicarboxylic acids take in effect through in-situ replacement of surfactant so as to improve the contact of silver flakes and their distribution and consequently to enhance the electrical property of the ECAs. The curing behavior of the prepared ECAs with adding different dicarboxylic acids is characterized by a differential scanning calorimeter, the bulk resistivity of the ECAs is evaluated by a high-speed programmable micro-ohmmeter and the morphologies of the ECAs are analyzed by SEM. The results show that adipic acid can be a very good additive not only facilitating the curing with an obvious increase of the reaction heat, but also improving the electrical property of the ECAs with a significant reduction of the bulk resistivity.
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