先进的逻辑和专业技术,为超大规模集成电路制造在中国快速扩张

M. Chi, Hanming Wu
{"title":"先进的逻辑和专业技术,为超大规模集成电路制造在中国快速扩张","authors":"M. Chi, Hanming Wu","doi":"10.1109/CSTIC.2017.7919751","DOIUrl":null,"url":null,"abstract":"As the electronics production at China continuously growing, the semiconductor chip consumption already exceeds 50% of global total since 2012. This attracts investment of wafer Fab's as well as advanced technologies development at China from both domestic and international partners. In turn, all semiconductor manufacturing related development and services (i.e. tools, materials, packaging, testing, bumping, assembly, etc.) as well as design services (i.e. EDA, fabless, IP design, etc.) are also in fast expansion mode into an efficient eco-system with competitive advantages. This further fueled the growth of electronic production at China.","PeriodicalId":6846,"journal":{"name":"2017 China Semiconductor Technology International Conference (CSTIC)","volume":"15 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2017-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Advanced logic and specialty technologies for VLSI manufacturing in fast expansion at China\",\"authors\":\"M. Chi, Hanming Wu\",\"doi\":\"10.1109/CSTIC.2017.7919751\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As the electronics production at China continuously growing, the semiconductor chip consumption already exceeds 50% of global total since 2012. This attracts investment of wafer Fab's as well as advanced technologies development at China from both domestic and international partners. In turn, all semiconductor manufacturing related development and services (i.e. tools, materials, packaging, testing, bumping, assembly, etc.) as well as design services (i.e. EDA, fabless, IP design, etc.) are also in fast expansion mode into an efficient eco-system with competitive advantages. This further fueled the growth of electronic production at China.\",\"PeriodicalId\":6846,\"journal\":{\"name\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"15 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-03-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC.2017.7919751\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2017.7919751","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

随着中国电子产品产量的持续增长,自2012年以来,半导体芯片的消费量已超过全球总量的50%。这吸引了国内外合作伙伴对中国晶圆厂的投资以及先进技术的开发。反过来,所有半导体制造相关的开发和服务(如工具、材料、封装、测试、碰撞、组装等)以及设计服务(如EDA、无晶圆厂、IP设计等)也在快速扩展,形成一个具有竞争优势的高效生态系统。这进一步推动了中国电子产品生产的增长。
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Advanced logic and specialty technologies for VLSI manufacturing in fast expansion at China
As the electronics production at China continuously growing, the semiconductor chip consumption already exceeds 50% of global total since 2012. This attracts investment of wafer Fab's as well as advanced technologies development at China from both domestic and international partners. In turn, all semiconductor manufacturing related development and services (i.e. tools, materials, packaging, testing, bumping, assembly, etc.) as well as design services (i.e. EDA, fabless, IP design, etc.) are also in fast expansion mode into an efficient eco-system with competitive advantages. This further fueled the growth of electronic production at China.
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