{"title":"低功耗数字片上系统设计的趋势","authors":"R. Saleh, G. Lim, T. Kadowaki, K. Uchiyama","doi":"10.1109/ISQED.2002.996775","DOIUrl":null,"url":null,"abstract":"A study of the future trends in low-power System-on-Chip (SoC) designs is presented, based on the recently announced ITRS-2001 technology characteristics for both high-performance and low-power devices from 2001 to 2016. We forecast the logic/memory composition of a reference low-power PDA design with an area constraint of 1 cm/sup 2/ using both a bottom-up, power dissipation-constrained chip model and a top-down, design resource-constrained model. Together, these analyses indicate that without accelerated improvements in both chip design productivity and leakage power management, future SoC designs will be comprised of 80-90% memory, with the remaining logic blocks composed of special-purpose reusable IP cores, and a smaller fraction of the chip containing newly designed logic.","PeriodicalId":20510,"journal":{"name":"Proceedings International Symposium on Quality Electronic Design","volume":"49 1","pages":"373-378"},"PeriodicalIF":0.0000,"publicationDate":"2002-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":"{\"title\":\"Trends in low power digital system-on-chip designs\",\"authors\":\"R. Saleh, G. Lim, T. Kadowaki, K. Uchiyama\",\"doi\":\"10.1109/ISQED.2002.996775\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A study of the future trends in low-power System-on-Chip (SoC) designs is presented, based on the recently announced ITRS-2001 technology characteristics for both high-performance and low-power devices from 2001 to 2016. We forecast the logic/memory composition of a reference low-power PDA design with an area constraint of 1 cm/sup 2/ using both a bottom-up, power dissipation-constrained chip model and a top-down, design resource-constrained model. Together, these analyses indicate that without accelerated improvements in both chip design productivity and leakage power management, future SoC designs will be comprised of 80-90% memory, with the remaining logic blocks composed of special-purpose reusable IP cores, and a smaller fraction of the chip containing newly designed logic.\",\"PeriodicalId\":20510,\"journal\":{\"name\":\"Proceedings International Symposium on Quality Electronic Design\",\"volume\":\"49 1\",\"pages\":\"373-378\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"21\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Symposium on Quality Electronic Design\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2002.996775\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2002.996775","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Trends in low power digital system-on-chip designs
A study of the future trends in low-power System-on-Chip (SoC) designs is presented, based on the recently announced ITRS-2001 technology characteristics for both high-performance and low-power devices from 2001 to 2016. We forecast the logic/memory composition of a reference low-power PDA design with an area constraint of 1 cm/sup 2/ using both a bottom-up, power dissipation-constrained chip model and a top-down, design resource-constrained model. Together, these analyses indicate that without accelerated improvements in both chip design productivity and leakage power management, future SoC designs will be comprised of 80-90% memory, with the remaining logic blocks composed of special-purpose reusable IP cores, and a smaller fraction of the chip containing newly designed logic.