Preparation and characterization of silver self-metallization on polyimide

In this work, silver (Ag) self-metallization on a polyimide (PI) film was prepared through autocatalytic plating. PI films were prepared through the solution casting method, followed by etching with potassium hydroxide (KOH) solution, sensitization with tin chloride (SnCl2), and the use of palladium chloride (PdCl2) to activate the surface of PI. Energy-dispersive X-ray analysis (EDX) showed the highest peak in the (Ag) region and confirmed the presence of AgNPs. The diffraction peaks at 2θ = 38.2°, 44.5°, 64.6°, and 78.2° represented the 111, 200, 220, and 311 planes of Ag, respectively. The FT–IR analysis for Ag-metalized PI showed that the =C-O-C= stretching absorption bands at 1735 cm−1 had no changes in position, only a significant difference in peak size at the deposition time increase. The formation of new bands (N–H stretching absorption band and N–C stretching band) assigned at 2325 and 955 cm−1 indicated strong coordination between N atoms and silver nanoparticles. The C–C stretching and = C–H plane vibration band at 1488 and 1117 cm−1 are shifted to 1413 and 1112 cm−1, indicating the silver nanoparticles' interaction with the polymer backbone. The thermal stability of PI- and Ag-metalized PI films at various deposition times (5, 10, and 15 min) was examined using thermogravimetric analysis (TGA). For PI, T0, T5, T10, and Tmax were observed to be 388°C, 402°C, 414°C, and 515°C, respectively. When the deposition time increased, the thermal stability increased. As a function of the deposition, the thickness and surface morphology of the copper layer on the PI films were characterized using scanning electron microscopy (SEM).