环氧基聚合物复合材料的低频介电响应

É. David, A. Sami, R. Soltani, M. Frechette, S. Savoie
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引用次数: 4

摘要

在室温下,聚合物材料的低频介电响应通常在10-5 ~ 102 Hz范围内,它与各种现象有关。直接传导,准直流电传导,也称为低频色散,α偶极弛豫机制,位于玻璃聚合物的低频部分,包括在这些现象中,通常出现在1hz以下。负载的存在,纳米或微米的尺寸,是已知的显著影响低频介电性质的基矩阵。与形态和界面效应相关的新机制,如麦克斯韦-瓦格纳界面极化,可以叠加到已经存在的弛豫机制上。为了进一步研究各种增强环氧基复合材料的低频响应,对其进行了时域和频域谱分析。制备了石英含量高达60%的不同类型的环氧微复合材料和负载SiC颗粒的微复合材料。测量也进行了环氧-云母复合材料由纸背云母片粘合树脂。
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Low-Frequency Dielectric Response of Epoxy-Based Polymer Composites
The low-frequency dielectric response of polymeric materials, typically in the range of 10-5 to 102 Hz at room temperature, is related to various phenomena. Direct conduction, quasi DC conduction also known as low-frequency dispersion, alpha dipolar relaxation mechanisms, which are located in the low-frequency part of the spectrum for glassy polymers, are included in these phenomena and appeared generally below 1 Hz. The presence of a load, nano or micrometric in size, is known to significantly affect the low-frequency dielectric properties of the based matrix. New mechanisms related to the morphology and interfacial effects, such as the Maxwell-Wagner interfacial polarization, could then superimpose to the already existing relaxation mechanisms. In order to further investigate the low-frequency response of various reinforced epoxy-based composites, both time and frequency domain spectroscopy were conducted. Different types of epoxy microcomposites containing a high content of quartz, i.e. 60% wt. and microcomposites load with SiC particles, were prepared. Measurements were also performed on epoxy-mica composite made of paper-backed mica flakes bonded by the resin.
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