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引用次数: 14

摘要

用数值方法研究了成像平面有限尺寸对辐射发射抑制的影响。在减小共模电流对印刷电路板导体的辐射场方面具有重要的应用价值。早期的实验结果表明,共模电流往往是PCB地面排放的主要贡献者[1,2]。另外的实验结果表明,在PCB下面放置金属平面可以显著减少排放[3]。本文给出的数值结果旨在证实这些观测结果,并且是在无限长但有限宽的地平面(2D)和有限宽和长度的地平面(和电流)(3D)下获得的。这些结果表明,当在其下方放置有限地平面时,隔离电流的辐射发射减少了约lOdB。它还表明,只要地平面尺寸大于大约一个波长,电流在地平面以上的高度是电小的,电流不太接近地平面的边缘,图像理论提供了一个充分的表征问题,即使地平面尺寸是有限的。
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Effect Of Image Plane Dimensions On Radiated Emissions
The effect of finite dimensions of an image plane on the reduction of radiated emissions is investigated numerically. The applications are important in the reduction of the radiated fields from common-mode currents on Printed Circuit Board (PCB) conductors (lands). Earlier experimental results showed that common-mode currents tend to be the dominant contributors to the emissions from PCB lands [1,2]. Additional experimental results showed that placement of a metallic plane beneath the PCB could dramatically reduce the emissions [3]. The numerical results presented in this paper are intended to confirm these observations and are obtained for a ground plane of infinite length but finite width (2D) and for a ground plane (and current) of finite width and length (3D). These results show that reductions of radiated emissions of the isolated current of around lOdB are obtained when a finite ground plane is placed beneath it. It is also shown that as long as the ground plane dimensions are larger than approximately one wavelength, the height of the current above the ground plane is electrically small and the current is not too close to the edges of the ground plane, image theory provides an adequate characterization of the problem even though the ground plane dimensions are finite.
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