电子雾化喷射打印:可穿戴设备的使能技术

C. Cooper, Bruce Hughes
{"title":"电子雾化喷射打印:可穿戴设备的使能技术","authors":"C. Cooper, Bruce Hughes","doi":"10.23919/PanPacific48324.2020.9059444","DOIUrl":null,"url":null,"abstract":"Additive manufacturing has revolutionized the way products are designed and fabricated to include the field of printed electronics. Direct write (DW) technologies used to print three-dimensional (3D) electronic and sensor devices have experienced spectacular growth due to their capability to offer rapid prototyping of high-performance devices for a broad range of applications. This growth is driven by many factors to include significantly reduced design-to-product lead time and fabrication of complex geometries on conformal and flexible substrates. Originally developed by the Defense Advanced Research Projects Agency (DARPA) Mesoscopic Integrated Conformal Electronics (MICE) Program for the fabrication of mesoscale electronics, DW technologies have been explored for a range of applications including active and passive components, sensors, 3D structures, as well as applications in biology. This paper focuses on one emerging DW approach, Aerosol Jet Printing (AJP), as a non-contact method to print fine features using different types of materials over various surfaces. Aerosol Jet systems are able to print a wide variety of electronically, optically, and biologically functional materials on geometrically complex substrates that can be conformal, flexible, and stretchable. The Aerosol Jet process utilizes printable inks based on solutions or nanoparticle suspensions and can include metals, alloys, ceramics, polymers, adhesives, and/or biomaterials. A wide variety of substrates, to include silicon, polyimide, glass, FR-4 and aluminum oxide can be used to print these materials provided the ink is compatible with the substrate. Like other DW technologies, the AJP process offers the distinct benefit of fabrication without conventional masks, with a reduction in material consumption due to selective deposition of inks at digitally defined locations on the substrate. Use of this additive process eliminates the waste of hazardous materials used in the etching processes employed by subtractive methods. AJP systems use an atomizer to create a dense aerosol of micro-droplets that are focused into an aerosol stream, resulting in deposits that can be one tenth the size of the nozzle opening at a standoff height of up to 5 millimeters. These capabilities enable the fabrication of highly integrated devices expanding from the originally targeted mesoscale application to micro- and nano-scale applications. Design and innovative fabrication of more connected and “smart” products can be realized using AJP to meet the miniaturized, flexible, and conformal form factors desired in today's Internet of Things (IoT) global marketplace. AJP technology has opened up new avenues for bio-integrated electronics to include electronic textiles, wearable electrochemical systems, electronic epidermal tattoos, and permanent and dissolvable implantable devices. While it has been demonstrated that AJP is an enabling technology in the growing field of wearable devices, there are major challenges in widespread adoption of this innovative approach. This paper provides an overview of AJP technology and summarizes the historical underpinning of its development, underlying principles of its technique, and challenges presented in widening its adoption with industry.","PeriodicalId":6691,"journal":{"name":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"27 1","pages":"1-11"},"PeriodicalIF":0.0000,"publicationDate":"2020-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Aerosol Jet Printing of Electronics: An Enabling Technology for Wearable Devices\",\"authors\":\"C. Cooper, Bruce Hughes\",\"doi\":\"10.23919/PanPacific48324.2020.9059444\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Additive manufacturing has revolutionized the way products are designed and fabricated to include the field of printed electronics. Direct write (DW) technologies used to print three-dimensional (3D) electronic and sensor devices have experienced spectacular growth due to their capability to offer rapid prototyping of high-performance devices for a broad range of applications. This growth is driven by many factors to include significantly reduced design-to-product lead time and fabrication of complex geometries on conformal and flexible substrates. Originally developed by the Defense Advanced Research Projects Agency (DARPA) Mesoscopic Integrated Conformal Electronics (MICE) Program for the fabrication of mesoscale electronics, DW technologies have been explored for a range of applications including active and passive components, sensors, 3D structures, as well as applications in biology. This paper focuses on one emerging DW approach, Aerosol Jet Printing (AJP), as a non-contact method to print fine features using different types of materials over various surfaces. Aerosol Jet systems are able to print a wide variety of electronically, optically, and biologically functional materials on geometrically complex substrates that can be conformal, flexible, and stretchable. The Aerosol Jet process utilizes printable inks based on solutions or nanoparticle suspensions and can include metals, alloys, ceramics, polymers, adhesives, and/or biomaterials. A wide variety of substrates, to include silicon, polyimide, glass, FR-4 and aluminum oxide can be used to print these materials provided the ink is compatible with the substrate. Like other DW technologies, the AJP process offers the distinct benefit of fabrication without conventional masks, with a reduction in material consumption due to selective deposition of inks at digitally defined locations on the substrate. Use of this additive process eliminates the waste of hazardous materials used in the etching processes employed by subtractive methods. AJP systems use an atomizer to create a dense aerosol of micro-droplets that are focused into an aerosol stream, resulting in deposits that can be one tenth the size of the nozzle opening at a standoff height of up to 5 millimeters. These capabilities enable the fabrication of highly integrated devices expanding from the originally targeted mesoscale application to micro- and nano-scale applications. Design and innovative fabrication of more connected and “smart” products can be realized using AJP to meet the miniaturized, flexible, and conformal form factors desired in today's Internet of Things (IoT) global marketplace. AJP technology has opened up new avenues for bio-integrated electronics to include electronic textiles, wearable electrochemical systems, electronic epidermal tattoos, and permanent and dissolvable implantable devices. While it has been demonstrated that AJP is an enabling technology in the growing field of wearable devices, there are major challenges in widespread adoption of this innovative approach. This paper provides an overview of AJP technology and summarizes the historical underpinning of its development, underlying principles of its technique, and challenges presented in widening its adoption with industry.\",\"PeriodicalId\":6691,\"journal\":{\"name\":\"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)\",\"volume\":\"27 1\",\"pages\":\"1-11\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-02-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/PanPacific48324.2020.9059444\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 Pan Pacific Microelectronics Symposium (Pan Pacific)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/PanPacific48324.2020.9059444","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9

摘要

增材制造已经彻底改变了产品的设计和制造方式,包括印刷电子领域。用于打印三维(3D)电子和传感器设备的直写(DW)技术经历了惊人的增长,因为它们能够为广泛的应用提供高性能设备的快速原型。这种增长是由许多因素驱动的,包括显著缩短了从设计到产品的交货时间,以及在保形和柔性基板上制造复杂几何形状。DW技术最初是由美国国防高级研究计划局(DARPA)的介观集成共形电子(MICE)计划开发的,用于制造中尺度电子产品,目前已被探索用于一系列应用,包括有源和无源组件、传感器、3D结构以及生物学应用。本文重点介绍了一种新兴的DW方法,气溶胶喷射打印(AJP),作为一种非接触方法,在各种表面上使用不同类型的材料打印精细特征。气溶胶喷射系统能够在几何形状复杂的基材上打印各种各样的电子、光学和生物功能材料,这些材料可以是保形的、柔性的和可拉伸的。气溶胶喷射工艺利用基于溶液或纳米颗粒悬浮液的可打印墨水,可以包括金属、合金、陶瓷、聚合物、粘合剂和/或生物材料。各种各样的承印物,包括硅、聚酰亚胺、玻璃、FR-4和氧化铝,只要油墨与承印物兼容,就可以用于印刷这些材料。与其他DW技术一样,AJP工艺提供了无需传统掩模制造的独特优势,由于在基板上的数字定义位置选择性沉积油墨,因此减少了材料消耗。使用这种添加剂的过程消除了在蚀刻过程中使用的有害物质的浪费,采用减法的方法。AJP系统使用雾化器来产生密集的微液滴气溶胶,这些微液滴被集中到气溶胶流中,从而产生沉积物,其大小可达到喷嘴开口的十分之一,高度可达5毫米。这些功能使高度集成器件的制造从最初的目标中尺度应用扩展到微纳米级应用。使用AJP可以实现更多连接和“智能”产品的设计和创新制造,以满足当今物联网(IoT)全球市场所需的小型化,柔性化和保形尺寸。AJP技术为生物集成电子技术开辟了新的途径,包括电子纺织品、可穿戴电化学系统、电子表皮纹身以及永久和可溶解的植入式设备。虽然已经证明AJP是可穿戴设备领域的一项使能技术,但在广泛采用这种创新方法方面存在重大挑战。本文概述了AJP技术,并总结了其发展的历史基础,其技术的基本原理,以及在扩大其在工业中的应用中所面临的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Aerosol Jet Printing of Electronics: An Enabling Technology for Wearable Devices
Additive manufacturing has revolutionized the way products are designed and fabricated to include the field of printed electronics. Direct write (DW) technologies used to print three-dimensional (3D) electronic and sensor devices have experienced spectacular growth due to their capability to offer rapid prototyping of high-performance devices for a broad range of applications. This growth is driven by many factors to include significantly reduced design-to-product lead time and fabrication of complex geometries on conformal and flexible substrates. Originally developed by the Defense Advanced Research Projects Agency (DARPA) Mesoscopic Integrated Conformal Electronics (MICE) Program for the fabrication of mesoscale electronics, DW technologies have been explored for a range of applications including active and passive components, sensors, 3D structures, as well as applications in biology. This paper focuses on one emerging DW approach, Aerosol Jet Printing (AJP), as a non-contact method to print fine features using different types of materials over various surfaces. Aerosol Jet systems are able to print a wide variety of electronically, optically, and biologically functional materials on geometrically complex substrates that can be conformal, flexible, and stretchable. The Aerosol Jet process utilizes printable inks based on solutions or nanoparticle suspensions and can include metals, alloys, ceramics, polymers, adhesives, and/or biomaterials. A wide variety of substrates, to include silicon, polyimide, glass, FR-4 and aluminum oxide can be used to print these materials provided the ink is compatible with the substrate. Like other DW technologies, the AJP process offers the distinct benefit of fabrication without conventional masks, with a reduction in material consumption due to selective deposition of inks at digitally defined locations on the substrate. Use of this additive process eliminates the waste of hazardous materials used in the etching processes employed by subtractive methods. AJP systems use an atomizer to create a dense aerosol of micro-droplets that are focused into an aerosol stream, resulting in deposits that can be one tenth the size of the nozzle opening at a standoff height of up to 5 millimeters. These capabilities enable the fabrication of highly integrated devices expanding from the originally targeted mesoscale application to micro- and nano-scale applications. Design and innovative fabrication of more connected and “smart” products can be realized using AJP to meet the miniaturized, flexible, and conformal form factors desired in today's Internet of Things (IoT) global marketplace. AJP technology has opened up new avenues for bio-integrated electronics to include electronic textiles, wearable electrochemical systems, electronic epidermal tattoos, and permanent and dissolvable implantable devices. While it has been demonstrated that AJP is an enabling technology in the growing field of wearable devices, there are major challenges in widespread adoption of this innovative approach. This paper provides an overview of AJP technology and summarizes the historical underpinning of its development, underlying principles of its technique, and challenges presented in widening its adoption with industry.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Development of Materials Informatics Platform Technology for Optical Co-Packaging Customizable Capacitive Sensor System Using Printed Electronics on Window Glass The Heterogeneous Integration Roadmap: Enabling Technology for Systems of the Future Advanced Substrate Technology for Heterogeneous Integration
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1