Fabrication and filling quality optimization of the high density and small size through silicon via array for three-dimensional packaging

High density and small size through silicon via is becoming a research and development hotspot of global academia and industry. The density and size of TSV is often constraint with deep reactive ion etching process, TSV filling process and other process as the diameter of TSV decreases to below 20 micrometer or smaller. In this paper, high density and small size TSV array are fabricated (The diameter of TSV is about 20 micrometer, and the density of TSV is 90000 pins per square centimeter) and their corresponding filling quality are optimized through controlling the profile of TSV in deep reactive ion etching process and taking additives into consideration in TSV filling process. All test results verify the good fabrication and filling quality of this high density and small size through silicon via array for three-dimensional packaging.