用刻槽微悬臂梁测量钨钽合金脆-韧转变温度

B. Li, T. Marrow, David J Armstrong
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摘要

对一种工业级W-1%Ta合金进行了室温至700℃的高温微断裂试验,试验采用了v形缺口微悬臂梁。随着温度的升高,试样的条件断裂韧性(KQc)逐渐增大,在~600℃出现了微尺度的脆-韧转变温度。这比同样材料(~400°C)的宏观四点弯曲测试略高,并且与大多数纯钨的微bdtt明显较低的文献相矛盾。结果表明,位错运动与试样尺寸无关。结果表明,该合金的微bdtt较高是由于钽元素的存在。
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Measuring the Brittle-to-Ductile Transition Temperature of Tungsten-Tantalum Alloy Using Chevron-Notched Micro-Cantilevers
High-temperature micro-fracture tests of an industrial grade W-1%Ta alloy were performed from room temperature up to 700 °C, using chevron-notched micro-cantilevers. A gradual increase of conditional fracture toughness (KQc) was measured with increasing temperature, and a microscale brittle-to-ductile transition temperature was found at ~600 °C. This is slightly higher than macroscopic four-point bending tests from the same material (~400 °C), and contradicts most literatures for pure tungsten that shows a significant lower micro-BDTT. The results suggested that dislocation motion should be independent of the specimen size. It is concluded that the higher micro-BDTT is due to tantalum in this alloy.
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