{"title":"层压脱层失效分析","authors":"Ying Yang","doi":"10.1109/ICEPT.2016.7583093","DOIUrl":null,"url":null,"abstract":"This paper presents a failure analysis for delamination. White spots were found on four-layer PCBs. Cross-sectioning showed that there was delamination/blistering within prepreg. Thermal analysis was performed, and it turned out that delamination/blistering is related to poor heat resistance of base substrate.","PeriodicalId":6881,"journal":{"name":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","volume":"27 1","pages":"73-75"},"PeriodicalIF":0.0000,"publicationDate":"2016-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Failure analysis for laminate delamination\",\"authors\":\"Ying Yang\",\"doi\":\"10.1109/ICEPT.2016.7583093\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a failure analysis for delamination. White spots were found on four-layer PCBs. Cross-sectioning showed that there was delamination/blistering within prepreg. Thermal analysis was performed, and it turned out that delamination/blistering is related to poor heat resistance of base substrate.\",\"PeriodicalId\":6881,\"journal\":{\"name\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"27 1\",\"pages\":\"73-75\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 17th International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2016.7583093\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 17th International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2016.7583093","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper presents a failure analysis for delamination. White spots were found on four-layer PCBs. Cross-sectioning showed that there was delamination/blistering within prepreg. Thermal analysis was performed, and it turned out that delamination/blistering is related to poor heat resistance of base substrate.
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