SiC可靠性研究工具的开发

T. Phulpin , A. Jaffre , J. Alvares , M. Lazar
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引用次数: 0

摘要

了解失效机制对于确保半导体新技术的可靠性至关重要。在现有的各种专用于硅基器件的工具中,没有针对碳化硅(SiC)器件的共识方法。与硅相比,这种半导体为电力电子提供了非常有趣的特性,但这些失效是不同的,需要研究。本文将比较应用于故障的不同方法,重点是锁定热成像和微拉曼分析。三个器件将被评估,一个垂直二极管,一个横向二极管和一个MESFET。最后将推荐一种方法,作为进一步研究失效机制的有价值和可靠的解决方案。
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Development of SiC reliability study tool

Understanding the failure mechanisms is essential to ensure reliability for a new technology of semiconductors. Amongst various existing tools dedicated to silicon-based devices, there is no consensual method for silicon carbide (SiC) devices. This semiconductor offers very interesting properties for power electronics in comparison with Si, but these failures are different and need to be studied. This paper will compare different methods applied to failures, focusing on lock-in thermography and micro-Raman analysis. Three devices will be evaluated, a vertical diode, a lateral diode and a MESFET. A methodology will finally be recommended as a valuable and robust solution for failures mechanisms further studies.

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