固体钴与熔融铜的反应。二、熔铜向固体钴的迁移及铜-钴界面结构研究

T. Ishida
{"title":"固体钴与熔融铜的反应。二、熔铜向固体钴的迁移及铜-钴界面结构研究","authors":"T. Ishida","doi":"10.2207/qjjws1943.40.1111","DOIUrl":null,"url":null,"abstract":"A basic investigation in brazing was made of the migration or the penetration of molten copper into solid cobalt and of the structure of copper-cobalt interface in the temperature range 1100°-1300°C for the reaction time from 0 to 30 min. The principal mechanism of the migration of molten copper into solid cobalt was shown to be volume diffusion. Initial rate of the penertation of molten copper into cobalt is 0.4-1.1×10-3 mm/min. The thickness of Cu-penetrated layer ranged from 5.4 to 50.4μ and it increase in proportion to the square root of the reaction time. The obtained value of the penetration-rateconstant is 2.57.3×10-3 mm/min1/2 and from the temperature dependence of the rate-constant the value of the activation energy for the penetration, 23.5 Kcal/mole was obtained. In copper-cobalt interface, a cobalt dendrite layer which had been crystallized on the copper side of the interface during solidification was recognizedand on the opposite side of this interface, a thicker copper-enriched cobalt solid solution.","PeriodicalId":21586,"journal":{"name":"Science reports of the Research Institutes, Tohoku University. Ser. A, Physics, chemistry and metallurgy","volume":"46 1","pages":"257"},"PeriodicalIF":0.0000,"publicationDate":"1972-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Reaction of Solid Cobalt with Molten Copper. II : On the Migration of Molten Copper into Solid Cobalt and the Structure of Copper-Cobalt Interface\",\"authors\":\"T. Ishida\",\"doi\":\"10.2207/qjjws1943.40.1111\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A basic investigation in brazing was made of the migration or the penetration of molten copper into solid cobalt and of the structure of copper-cobalt interface in the temperature range 1100°-1300°C for the reaction time from 0 to 30 min. The principal mechanism of the migration of molten copper into solid cobalt was shown to be volume diffusion. Initial rate of the penertation of molten copper into cobalt is 0.4-1.1×10-3 mm/min. The thickness of Cu-penetrated layer ranged from 5.4 to 50.4μ and it increase in proportion to the square root of the reaction time. The obtained value of the penetration-rateconstant is 2.57.3×10-3 mm/min1/2 and from the temperature dependence of the rate-constant the value of the activation energy for the penetration, 23.5 Kcal/mole was obtained. In copper-cobalt interface, a cobalt dendrite layer which had been crystallized on the copper side of the interface during solidification was recognizedand on the opposite side of this interface, a thicker copper-enriched cobalt solid solution.\",\"PeriodicalId\":21586,\"journal\":{\"name\":\"Science reports of the Research Institutes, Tohoku University. Ser. A, Physics, chemistry and metallurgy\",\"volume\":\"46 1\",\"pages\":\"257\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1972-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Science reports of the Research Institutes, Tohoku University. Ser. A, Physics, chemistry and metallurgy\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2207/qjjws1943.40.1111\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Science reports of the Research Institutes, Tohoku University. Ser. A, Physics, chemistry and metallurgy","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2207/qjjws1943.40.1111","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在1100℃~ 1300℃的温度范围内,反应时间为0 ~ 30min,对铜熔液向固体钴的迁移或渗透以及铜-钴界面的结构进行了基本研究。铜熔液向固体钴迁移的主要机制是体积扩散。熔融铜渗入钴的初始速率为0.4-1.1×10-3 mm/min。渗铜层厚度在5.4 ~ 50.4μ之间,与反应时间的平方根成正比。得到的穿透速率常数为2.57.3×10-3 mm/min /2,由速率常数对温度的依赖关系得到的穿透活化能为23.5 Kcal/mol。在铜-钴界面中,在界面的铜侧存在凝固过程中结晶的钴枝晶层,在界面的另一侧存在较厚的富铜钴固溶体。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
The Reaction of Solid Cobalt with Molten Copper. II : On the Migration of Molten Copper into Solid Cobalt and the Structure of Copper-Cobalt Interface
A basic investigation in brazing was made of the migration or the penetration of molten copper into solid cobalt and of the structure of copper-cobalt interface in the temperature range 1100°-1300°C for the reaction time from 0 to 30 min. The principal mechanism of the migration of molten copper into solid cobalt was shown to be volume diffusion. Initial rate of the penertation of molten copper into cobalt is 0.4-1.1×10-3 mm/min. The thickness of Cu-penetrated layer ranged from 5.4 to 50.4μ and it increase in proportion to the square root of the reaction time. The obtained value of the penetration-rateconstant is 2.57.3×10-3 mm/min1/2 and from the temperature dependence of the rate-constant the value of the activation energy for the penetration, 23.5 Kcal/mole was obtained. In copper-cobalt interface, a cobalt dendrite layer which had been crystallized on the copper side of the interface during solidification was recognizedand on the opposite side of this interface, a thicker copper-enriched cobalt solid solution.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Helium Behavior in Vanadium-Based Alloys Irradiated in the Dynamic Helium Charging Experiments CAM Analysis of Dimensionality Crossover Study on A3 Transformation of Dispersion- Strengthened Iron The Effect of Hydrostatic Tensile Stress on Fracture in Some Structural Alloys On the Twist Effect of V-H Alloys Associated with the Precipitation of Hydrides
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1