{"title":"固体钴与熔融铜的反应。二、熔铜向固体钴的迁移及铜-钴界面结构研究","authors":"T. Ishida","doi":"10.2207/qjjws1943.40.1111","DOIUrl":null,"url":null,"abstract":"A basic investigation in brazing was made of the migration or the penetration of molten copper into solid cobalt and of the structure of copper-cobalt interface in the temperature range 1100°-1300°C for the reaction time from 0 to 30 min. The principal mechanism of the migration of molten copper into solid cobalt was shown to be volume diffusion. Initial rate of the penertation of molten copper into cobalt is 0.4-1.1×10-3 mm/min. The thickness of Cu-penetrated layer ranged from 5.4 to 50.4μ and it increase in proportion to the square root of the reaction time. The obtained value of the penetration-rateconstant is 2.57.3×10-3 mm/min1/2 and from the temperature dependence of the rate-constant the value of the activation energy for the penetration, 23.5 Kcal/mole was obtained. In copper-cobalt interface, a cobalt dendrite layer which had been crystallized on the copper side of the interface during solidification was recognizedand on the opposite side of this interface, a thicker copper-enriched cobalt solid solution.","PeriodicalId":21586,"journal":{"name":"Science reports of the Research Institutes, Tohoku University. Ser. A, Physics, chemistry and metallurgy","volume":"46 1","pages":"257"},"PeriodicalIF":0.0000,"publicationDate":"1972-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Reaction of Solid Cobalt with Molten Copper. II : On the Migration of Molten Copper into Solid Cobalt and the Structure of Copper-Cobalt Interface\",\"authors\":\"T. Ishida\",\"doi\":\"10.2207/qjjws1943.40.1111\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A basic investigation in brazing was made of the migration or the penetration of molten copper into solid cobalt and of the structure of copper-cobalt interface in the temperature range 1100°-1300°C for the reaction time from 0 to 30 min. The principal mechanism of the migration of molten copper into solid cobalt was shown to be volume diffusion. Initial rate of the penertation of molten copper into cobalt is 0.4-1.1×10-3 mm/min. The thickness of Cu-penetrated layer ranged from 5.4 to 50.4μ and it increase in proportion to the square root of the reaction time. The obtained value of the penetration-rateconstant is 2.57.3×10-3 mm/min1/2 and from the temperature dependence of the rate-constant the value of the activation energy for the penetration, 23.5 Kcal/mole was obtained. In copper-cobalt interface, a cobalt dendrite layer which had been crystallized on the copper side of the interface during solidification was recognizedand on the opposite side of this interface, a thicker copper-enriched cobalt solid solution.\",\"PeriodicalId\":21586,\"journal\":{\"name\":\"Science reports of the Research Institutes, Tohoku University. Ser. A, Physics, chemistry and metallurgy\",\"volume\":\"46 1\",\"pages\":\"257\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1972-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Science reports of the Research Institutes, Tohoku University. Ser. A, Physics, chemistry and metallurgy\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.2207/qjjws1943.40.1111\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Science reports of the Research Institutes, Tohoku University. Ser. A, Physics, chemistry and metallurgy","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2207/qjjws1943.40.1111","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The Reaction of Solid Cobalt with Molten Copper. II : On the Migration of Molten Copper into Solid Cobalt and the Structure of Copper-Cobalt Interface
A basic investigation in brazing was made of the migration or the penetration of molten copper into solid cobalt and of the structure of copper-cobalt interface in the temperature range 1100°-1300°C for the reaction time from 0 to 30 min. The principal mechanism of the migration of molten copper into solid cobalt was shown to be volume diffusion. Initial rate of the penertation of molten copper into cobalt is 0.4-1.1×10-3 mm/min. The thickness of Cu-penetrated layer ranged from 5.4 to 50.4μ and it increase in proportion to the square root of the reaction time. The obtained value of the penetration-rateconstant is 2.57.3×10-3 mm/min1/2 and from the temperature dependence of the rate-constant the value of the activation energy for the penetration, 23.5 Kcal/mole was obtained. In copper-cobalt interface, a cobalt dendrite layer which had been crystallized on the copper side of the interface during solidification was recognizedand on the opposite side of this interface, a thicker copper-enriched cobalt solid solution.