采用70nm mHEMT工艺的ka波段低噪声放大器用于宽带通信

Xu Cheng, L. Zhang, Xian‐jing Deng
{"title":"采用70nm mHEMT工艺的ka波段低噪声放大器用于宽带通信","authors":"Xu Cheng, L. Zhang, Xian‐jing Deng","doi":"10.1109/CSTIC.2017.7919889","DOIUrl":null,"url":null,"abstract":"The paper proposes a Ka band low noise amplifier (LNA) using 70nm GaAs metamorphic high electron mobility transistor (mHEMT). An ultra low noise three stage amplifier demonstrated an average noise figure of 1.1dB between 24GHz and 30GHz, an average small signal power gain of 27dB, a compact chip area of 1.5mm2 (with dicing streets) and a power consumption of around 80mW@1.5V power supply. The LNA features broad bandwidth, relatively high gain, low noise figure and compact size, and will be further used in broadband receivers for communications.","PeriodicalId":6846,"journal":{"name":"2017 China Semiconductor Technology International Conference (CSTIC)","volume":"68 1","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2017-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Ka-band low noise amplifier using 70nm mHEMT process for wideband communication\",\"authors\":\"Xu Cheng, L. Zhang, Xian‐jing Deng\",\"doi\":\"10.1109/CSTIC.2017.7919889\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper proposes a Ka band low noise amplifier (LNA) using 70nm GaAs metamorphic high electron mobility transistor (mHEMT). An ultra low noise three stage amplifier demonstrated an average noise figure of 1.1dB between 24GHz and 30GHz, an average small signal power gain of 27dB, a compact chip area of 1.5mm2 (with dicing streets) and a power consumption of around 80mW@1.5V power supply. The LNA features broad bandwidth, relatively high gain, low noise figure and compact size, and will be further used in broadband receivers for communications.\",\"PeriodicalId\":6846,\"journal\":{\"name\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"volume\":\"68 1\",\"pages\":\"1-2\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-03-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 China Semiconductor Technology International Conference (CSTIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CSTIC.2017.7919889\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 China Semiconductor Technology International Conference (CSTIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSTIC.2017.7919889","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

本文提出了一种采用70nm砷化镓变质高电子迁移率晶体管(mHEMT)的Ka波段低噪声放大器。超低噪声三级放大器在24GHz和30GHz之间的平均噪声系数为1.1dB,平均小信号功率增益为27dB,芯片面积紧凑为1.5mm2(带有切块街道),功耗约为80mW@1.5V电源。LNA具有带宽宽、增益相对较高、噪声系数低、尺寸紧凑等特点,将进一步应用于宽带通信接收机。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Ka-band low noise amplifier using 70nm mHEMT process for wideband communication
The paper proposes a Ka band low noise amplifier (LNA) using 70nm GaAs metamorphic high electron mobility transistor (mHEMT). An ultra low noise three stage amplifier demonstrated an average noise figure of 1.1dB between 24GHz and 30GHz, an average small signal power gain of 27dB, a compact chip area of 1.5mm2 (with dicing streets) and a power consumption of around 80mW@1.5V power supply. The LNA features broad bandwidth, relatively high gain, low noise figure and compact size, and will be further used in broadband receivers for communications.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Wafer size MOS2 with few monolayer synthesized by H2S sulfurization A fast and low-cost TSV/TGV filling method Finger print sensor molding thickness none destructive measurement with Terahertz technology Research of SMO process to improve the imaging capability of lithography system for 28nm node and beyond The study on the moldability and reliability of epoxy molding compound
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1