低熔点合金复合材料作为低热阻的热界面材料

2016 17th International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2016-08-01 DOI:10.1109/ICEPT.2016.7583147

Haoran Wen, Yaqiang Ji, Kai Zhang, M. Yuen, S. Lee, Xianzhu Fu, R. Sun, C. Wong

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引用次数: 0

摘要

将低熔点合金与Cu填料混合作为热界面材料。通过在铝块之间插入复合材料来研究其热性能。为了达到最低的热阻，铜填料的配比优化为50%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Low melting alloy composites as thermal interface materials with low thermal resistance

Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between Al blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.

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2016 17th International Conference on Electronic Packaging Technology (ICEPT)

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